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Wirewounded Inductor

744732102 / The <strong>744732102</strong> is a high-quality <strong>1mH radial leaded wire-wound inductor</strong> from <strong>Würth Elektronik</strong>, belonging to the <strong>WE-TI series</strong> of through-hole inductive components. Designed for filtering, energy storage, noise suppression, and general-purpose power electronics applications, the device combines a compact radial construction with reliable electrical and thermal performance. <br><br> The 744732102 provides a nominal inductance of <strong>1mH</strong> with an inductance tolerance of <strong>±5%</strong>. The inductance value is specified at a test frequency of <strong>1kHz</strong>, making the component suitable for power supply filtering, low-frequency filtering, DC/DC converter support circuits, and general-purpose inductive applications. <br><br> The component has a rated current of <strong>330mA</strong> and a saturation current of approximately <strong>600mA</strong>. Its wire-wound construction and ferrite drum core provide effective energy storage while maintaining predictable inductance characteristics across its specified operating range. <br><br> The 744732102 features a maximum <strong>DC resistance of 3.4Ω</strong>. Its electrical characteristics provide a practical combination of inductance, current capability, and compact physical dimensions for applications where a relatively high inductance value is required in a through-hole format. <br><br> With a typical <strong>self-resonant frequency of 1.8MHz</strong>, the device is suitable for filtering and suppression applications operating well below its resonant region. The unshielded construction makes it an economical solution for circuits where magnetic shielding is not a critical requirement. <br><br> The inductor uses a <strong>ferrite core</strong> together with a wire-wound coil structure, providing stable electrical characteristics and reliable operation. Its radial leaded design makes it particularly suitable for conventional through-hole PCB assembly, industrial electronics, power supplies, prototyping, and equipment requiring mechanically robust leaded components. <br><br> Designed for demanding operating environments, the 744732102 supports an <strong>operating temperature range from -40°C to +125°C</strong>. This broad temperature capability allows the component to be used in industrial equipment and power electronics exposed to significant temperature variations. <br><br> The component has a maximum diameter of approximately <strong>9.5mm</strong> and a maximum seated height of approximately <strong>7.5mm</strong>. Its compact vertical radial configuration helps minimize PCB footprint while maintaining the advantages of a traditional through-hole wire-wound inductor. <br><br> The <strong>744732102</strong> is widely used in <strong>DC/DC converter circuits, switching power supplies, power supply filters, EMI filtering circuits, LC filters, noise suppression networks, industrial control equipment, consumer electronics, communication equipment, LED power supplies, instrumentation, automotive support electronics, and general-purpose power electronics</strong> requiring a reliable 1mH through-hole inductor.
744732102

Description: The 744732102 is a high-quality 1mH radial leaded wire-wound indu ...
Package: TRAY | MOQ: 560 | MPQ: 560

NCP1239BD100R2G / The <strong>NCP1239BD100R2G</strong> is a high-performance <strong>fixed-frequency current-mode PWM controller</strong> from <strong>onsemi</strong>, specifically developed for offline flyback power converters and energy-efficient AC-DC switched-mode power supplies. Combining high-voltage startup, current-mode regulation, frequency foldback, and comprehensive protection functions, the device provides an efficient controller solution for compact isolated power supplies. <br><br> The NCP1239BD100R2G operates at a fixed nominal <strong>100kHz switching frequency</strong>, providing an effective balance between conversion efficiency, transformer size, EMI performance, and overall power density. Its current-mode control architecture provides fast response to line and load variations while simplifying feedback-loop compensation in isolated flyback converter designs. <br><br> An integrated <strong>high-voltage startup current source</strong> allows the controller to start directly from the rectified high-voltage DC rail. This architecture eliminates the need for a conventional high-loss startup resistor network and helps reduce standby power consumption while maintaining fast converter startup. <br><br> For improved efficiency at reduced loads, the controller incorporates <strong>frequency foldback and skip-mode operation</strong>. The switching frequency is progressively reduced as output power demand decreases, minimizing switching losses and helping power supply designs achieve low no-load and standby power consumption. <br><br> The NCP1239BD100R2G drives an <strong>external power MOSFET</strong>, allowing designers to select the switching transistor according to input voltage, output power, efficiency, and thermal requirements. This provides greater design flexibility compared with controllers that integrate a fixed power switching transistor. <br><br> The device incorporates <strong>internal ramp compensation</strong> to improve current-loop stability and prevent subharmonic oscillation under operating conditions where slope compensation is required. Its current-sense architecture provides cycle-by-cycle control of the primary-side MOSFET current for reliable power conversion and overload management. <br><br> Comprehensive protection functions include <strong>overload protection, overvoltage protection, brownout detection, overtemperature protection, maximum duty-cycle limitation, and current limiting</strong>. These integrated safety mechanisms help protect the power supply and connected load against abnormal operating conditions while reducing the number of external protection components required. <br><br> The controller also incorporates <strong>frequency jittering</strong>, which spreads switching energy across a wider frequency range to reduce electromagnetic interference peaks. This feature can simplify EMI filter design and help finished power supplies meet applicable conducted and radiated emissions requirements. <br><br> Packaged in a compact <strong>7-pin SOIC surface-mount package</strong>, the NCP1239BD100R2G is well suited for space-constrained power supply designs and automated PCB assembly. The combination of a <strong>100kHz switching frequency, high-voltage startup, current-mode control, low-load efficiency features, and integrated protection</strong> makes it an effective solution for modern offline flyback converter designs. <br><br> The <strong>NCP1239BD100R2G</strong> is widely used in <strong>AC-DC adapters, isolated flyback converters, auxiliary power supplies, industrial power supplies, consumer electronics, networking equipment, appliance power supplies, standby power systems, set-top boxes, embedded power supplies, battery chargers, and general-purpose switched-mode power supply applications</strong> requiring efficient and reliable offline power conversion.
NCP1239BD100R2G

Description: The NCP1239BD100R2G is a high-performance fixed-frequency current ...
Package: T&R | MOQ: 2500 | MPQ: 2500

NCP1219BD100R2G / The <strong>NCP1219BD100R2G</strong> is a high-performance <strong>current-mode PWM controller</strong> from <strong>onsemi</strong>, developed for offline AC-DC power supplies and isolated flyback converter applications. Combining a high-voltage startup circuit, adjustable skip-mode operation, current-mode regulation, and comprehensive fault protection, the device provides an efficient and cost-effective control solution for compact switched-mode power supplies. <br><br> The NCP1219BD100R2G operates at a fixed <strong>100kHz switching frequency</strong>, providing a practical balance between power conversion efficiency, magnetic component size, and switching losses. Its current-mode control architecture simplifies feedback-loop compensation while providing fast response to changing input voltage and output load conditions. <br><br> An integrated <strong>high-voltage startup FET</strong> allows the controller to start directly from the high-voltage input rail without requiring a conventional lossy startup resistor network. This architecture helps reduce standby power consumption and improves overall efficiency, particularly in applications that must comply with stringent no-load and standby energy requirements. <br><br> The device incorporates an <strong>adjustable skip-mode function</strong> that reduces switching activity during light-load conditions. By entering skip operation when the load decreases, the controller minimizes unnecessary switching losses and enables excellent standby power performance while maintaining regulated output voltage. <br><br> The NCP1219BD100R2G features a <strong>9.9V to 20V VCC operating range</strong> with a typical startup threshold of approximately <strong>12.7V</strong>. Its output driver is designed to control an external power MOSFET, giving designers flexibility to select the appropriate switching transistor according to the required output power, input voltage, and thermal performance. <br><br> Advanced protection functions include <strong>timer-based overload detection, overvoltage protection, overtemperature shutdown, current limiting, and external fault latch capability</strong>. The NCP1219B version incorporates <strong>auto-recovery protection</strong>, allowing the converter to periodically attempt a restart following applicable fault conditions instead of requiring manual power cycling. <br><br> Internal <strong>frequency jittering</strong> spreads switching energy across a wider frequency spectrum, helping reduce electromagnetic interference and simplifying EMI filter design. Integrated ramp compensation also improves control-loop stability, particularly in flyback converters operating at higher duty cycles. <br><br> The controller supports a maximum duty cycle of approximately <strong>80%</strong> and is designed for a junction temperature range of <strong>-40°C to +150°C</strong>. These characteristics make it suitable for demanding consumer, industrial, and auxiliary power applications requiring reliable operation over a broad temperature range. <br><br> Packaged in a compact <strong>SOIC-7 surface-mount package</strong>, the NCP1219BD100R2G reduces PCB area and external component requirements while providing the essential control and protection functions required for modern offline switching power supplies. <br><br> The <strong>NCP1219BD100R2G</strong> is widely used in <strong>AC-DC adapters, auxiliary power supplies, isolated flyback converters, industrial power supplies, consumer electronics, set-top boxes, networking equipment, appliance power supplies, standby power circuits, battery chargers, embedded power systems, and general-purpose switched-mode power supply applications</strong> requiring efficient current-mode PWM control.
NCP1219BD100R2G

Description: The NCP1219BD100R2G is a high-performance current-mode PWM contro ...
Package: 2500 | MOQ: | MPQ: 2500

MT41K64M16TW-107IT:J / The <strong>MT41K64M16TW-107IT:J</strong> is a high-performance <strong>1Gb DDR3L SDRAM memory IC</strong> from <strong>Micron Technology</strong>, designed for embedded computing, industrial automation, networking equipment, medical electronics, automotive systems, and high-speed digital applications. Featuring a <strong>64M × 16-bit organization</strong>, the device delivers reliable, high-bandwidth memory performance while maintaining low power consumption through its DDR3L architecture. It supports data transfer rates of up to <strong>1866 MT/s</strong> (933 MHz clock frequency). Operating with a <strong>1.35V nominal supply voltage</strong> (compatible with a supply range of approximately <strong>1.283V to 1.45V</strong>), the MT41K64M16TW-107IT:J significantly reduces power consumption compared to conventional 1.5V DDR3 devices, making it ideal for energy-efficient embedded systems and battery-powered applications. The device incorporates advanced DDR3L features including <strong>8 internal banks, programmable burst lengths, on-die termination (ODT), automatic refresh, self-refresh, power-down modes, and fly-by command/address architecture</strong>. These features improve signal integrity, simplify PCB routing, and maximize overall memory subsystem performance in high-speed designs. Packaged in a compact <strong>96-ball TFBGA package measuring 8 × 14 mm</strong>, the memory device minimizes PCB footprint while providing excellent thermal and electrical performance. The <strong>IT</strong> suffix identifies the industrial temperature version, supporting operation from <strong>-40°C to +95°C</strong>, making it suitable for harsh operating environments and long-life industrial products. The MT41K64M16TW-107IT:J is fully compliant with the JEDEC DDR3L standard and interfaces seamlessly with modern <strong>ARM processors, DSPs, FPGAs, SoCs, industrial controllers, communication processors, and multimedia platforms</strong>. Its high bandwidth and low latency make it well suited for applications requiring fast external memory access and deterministic performance. Manufactured using Micron's advanced DRAM process technology, the device delivers excellent reliability, low standby power, and long product availability. The combination of high-speed operation, low voltage, and industrial-grade reliability makes it an excellent choice for demanding embedded memory applications. The <strong>MT41K64M16TW-107IT:J</strong> is widely used in <strong>industrial automation controllers, FPGA development boards, embedded Linux systems, ARM-based computing platforms, networking equipment, HMI panels, medical devices, digital signage, automotive electronics, data acquisition systems, communication gateways, video processing equipment, test and measurement instruments, and high-performance embedded computing applications</strong>.
MT41K64M16TW-107IT:J

Description: The MT41K64M16TW-107IT:J is a high-performance 1Gb DDR3L SDRAM me ...
Package: T&R | MOQ: 1224 | MPQ: 1224

EC25EFA-MINIPCIE / The <strong>EC25EFA-MINIPCIE</strong> is a high-performance <strong>LTE Category 4 Mini PCIe cellular communication module</strong> from <strong>Quectel</strong>, designed for industrial Internet of Things (IoT), machine-to-machine (M2M), transportation, remote monitoring, industrial routers, embedded gateways, and networking equipment. Utilizing the industry-standard <strong>Mini PCI Express</strong> form factor, it enables rapid integration into embedded computing platforms while providing reliable broadband cellular connectivity. The module supports LTE Cat 4 download speeds of up to <strong>150 Mbps</strong> and upload speeds of up to <strong>50 Mbps</strong>. The <strong>EC25-AF</strong> regional variant is optimized for deployment in <strong>North America</strong> and supports multiple LTE, UMTS/HSPA+, and GSM/GPRS/EDGE frequency bands, ensuring seamless fallback to legacy cellular networks when LTE coverage is unavailable. This broad network compatibility makes the module suitable for industrial equipment deployed across regional carrier networks. An integrated <strong>multi-constellation GNSS receiver</strong> is available, supporting <strong>GPS, GLONASS, BeiDou (BDS), Galileo, and QZSS</strong>. The integrated positioning engine simplifies hardware development by eliminating the need for a separate GNSS receiver while providing accurate navigation, tracking, and timing capabilities for fleet management, telematics, and asset tracking applications. The EC25EFA-MINIPCIE provides extensive hardware interfaces including <strong>USB 2.0 High-Speed, UART, I²C, PCM digital audio, USIM interface, hardware reset, RF disable control, network status indication, and dedicated LTE diversity and GNSS antenna connectors</strong>. It also supports a comprehensive protocol stack including <strong>TCP/IP, UDP, PPP, FTP, FTPS, HTTP, HTTPS, MQTT, SSL/TLS, SMTP, NTP, QMI, CMUX, DFOTA, and Quectel enhanced AT commands</strong>, enabling rapid integration into industrial communication systems. Operating from a <strong>3.0V to 3.6V supply voltage (3.3V typical)</strong>, the module delivers excellent RF performance while maintaining low power consumption. The standard <strong>51.0 × 30.0 × 4.9 mm Mini PCIe form factor</strong> allows direct installation into Mini PCIe sockets, while the industrial operating temperature range of <strong>-40°C to +80°C</strong> ensures reliable operation in demanding environments. The module is fully supported under <strong>Windows, Linux, and Android</strong>, with USB networking modes including QMI, ECM, RNDIS, PPP, and USB serial interfaces depending on the operating system and firmware configuration. Its mature software ecosystem significantly reduces development time for industrial networking products and embedded IoT platforms. The <strong>EC25EFA-MINIPCIE</strong> is widely used in <strong>industrial LTE routers, IoT gateways, industrial PCs, fleet management systems, vehicle telematics, remote monitoring equipment, smart utility meters, digital signage, payment terminals, security systems, transportation equipment, agricultural automation, edge computing platforms, vending machines, and machine-to-machine (M2M) communication applications</strong> requiring reliable LTE Cat 4 connectivity in a standard Mini PCIe form factor.
EC25EFA-MINIPCIE

Description: The EC25EFA-MINIPCIE is a high-performance LTE Category 4 Mini PC ...
Package: TRAY | MOQ: 100 | MPQ: 100

EC25EUGA-MINIPCIE / The <strong>EC25EUGA-MINIPCIE</strong> is a high-performance <strong>LTE Category 4 Mini PCIe cellular communication module</strong> from <strong>Quectel</strong>, developed for industrial Internet of Things (IoT), machine-to-machine (M2M), transportation, networking equipment, remote monitoring, and embedded communication systems. Built in the industry-standard <strong>Mini PCI Express</strong> form factor, it enables rapid integration into industrial routers, gateways, embedded computers, and networking platforms while delivering reliable broadband cellular connectivity. It supports LTE Cat 4 download speeds of up to <strong>150 Mbps</strong> and upload speeds of up to <strong>50 Mbps</strong>. The <strong>EC25-EU</strong> regional variant is optimized for <strong>Europe and selected EMEA markets</strong>. It supports LTE-FDD Bands <strong>B1/B3/B7/B8/B20/B28A</strong>, LTE-TDD Bands <strong>B38/B40/B41</strong>, WCDMA Bands <strong>B1/B8</strong>, and GSM/EDGE Bands <strong>B3/B8</strong>. Full backward compatibility with 3G and 2G networks ensures uninterrupted communication where LTE service is unavailable. An optional integrated <strong>multi-constellation GNSS receiver</strong> supports <strong>GPS, GLONASS, BeiDou, Galileo, and QZSS</strong>, providing accurate positioning and navigation for fleet management, asset tracking, telematics, and location-aware IoT devices without requiring a separate GNSS receiver. The module offers comprehensive hardware interfaces including <strong>USB 2.0 High-Speed, UART, I²C, PCM digital audio, USIM interface, hardware reset, RF disable control, status indication, and dedicated LTE MIMO and GNSS antenna connections</strong>. It supports a complete protocol stack including <strong>TCP/IP, UDP, PPP, FTP, HTTP, HTTPS, MQTT, SSL/TLS, SMTP, NTP, DFOTA, and Quectel AT commands</strong>, enabling fast integration into industrial embedded systems and cloud-connected applications. Operating from a <strong>3.0V to 3.6V supply voltage (3.3V typical)</strong>, the EC25EUGA-MINIPCIE delivers excellent RF performance while maintaining low power consumption. The standard <strong>51.0 × 30.0 × 4.9 mm Mini PCIe form factor</strong> allows direct installation into Mini PCIe sockets, and the industrial operating temperature range of <strong>-35°C to +75°C</strong> (extended <strong>-40°C to +80°C</strong>) makes it suitable for demanding environments. The module is fully supported under <strong>Windows, Linux, Android, and OpenWrt</strong>, with USB networking modes such as ECM, RNDIS, MBIM, QMI, and PPP depending on firmware configuration. Its mature software ecosystem and industrial certifications simplify deployment in commercial and industrial networking equipment. The <strong>EC25EUGA-MINIPCIE</strong> is widely used in <strong>industrial LTE routers, IoT gateways, industrial PCs, vehicle telematics, fleet management systems, remote monitoring equipment, smart utility meters, payment terminals, digital signage, security systems, agricultural automation, transportation equipment, edge computing platforms, vending machines, and machine-to-machine (M2M) communication applications</strong> requiring reliable LTE Cat 4 connectivity in a standard Mini PCIe form factor.
EC25EUGA-MINIPCIE

Description: The EC25EUGA-MINIPCIE is a high-performance LTE Category 4 Mini P ...
Package: TRAY | MOQ: 1000 | MPQ: 100

MC20CE-04-SNN / The <strong>MC20CE-04-SNN</strong> is a compact <strong>Quad-Band GSM/GPRS cellular communication module with integrated multi-constellation GNSS</strong> from <strong>Quectel</strong>. Designed for industrial Internet of Things (IoT), machine-to-machine (M2M), wearable devices, asset tracking, vehicle telematics, and security applications, it combines reliable 2G wireless communication with high-performance satellite positioning in a highly integrated surface-mount package. The module supports GSM/GPRS data rates of up to <strong>85.6 kbps</strong> for both uplink and downlink communications. The module operates on <strong>Quad-Band GSM/GPRS networks (850/900/1800/1900 MHz)</strong>, enabling worldwide deployment wherever 2G infrastructure remains available. It integrates comprehensive TCP/IP networking capabilities, including <strong>TCP, UDP, PPP, FTP, HTTP, and SMTP</strong>, allowing developers to build connected IoT products without requiring an external communication processor. Integrated <strong>multi-constellation GNSS</strong> supports <strong>GPS, GLONASS, BeiDou, and QZSS</strong>, providing fast positioning, improved tracking sensitivity, and excellent navigation accuracy. The module incorporates an internal <strong>LNA (Low Noise Amplifier)</strong>, high-sensitivity GNSS receiver, and advanced positioning technologies such as <strong>EPO™</strong>, enabling faster time-to-first-fix and reliable operation even in challenging environments. The MC20CE-04-SNN provides a comprehensive collection of interfaces including <strong>UART, USB, I²C, PCM audio, ADC, GPIO, SIM card interface, antenna connections, NETLIGHT, RESET, and PWRKEY</strong>. It supports standard AT commands, voice calls, SMS messaging, embedded TCP/IP networking, and optional <strong>Bluetooth 3.0/4.0</strong> functionality on supported variants, simplifying integration into embedded systems and industrial controllers. Operating from a <strong>3.3V to 4.6V supply voltage (4.0V nominal)</strong>, the module is optimized for low-power operation while maintaining excellent RF performance. The compact <strong>18.7 × 16.0 × 2.1 mm LCC package</strong> reduces PCB area by approximately 40% compared with traditional GSM + GNSS solutions, making it ideal for space-constrained products. The industrial operating temperature range of <strong>-40°C to +85°C</strong> ensures reliable performance in demanding environments. The module supports firmware upgrades, remote management, and long-term industrial deployment while remaining compatible with standard embedded operating systems and microcontroller platforms. Its mature GSM/GPRS architecture provides a proven solution for applications where LTE connectivity is unnecessary or unavailable. The <strong>MC20CE-04-SNN</strong> is widely used in <strong>vehicle tracking systems, personal GPS trackers, wearable devices, pet trackers, fleet management, security equipment, industrial telemetry, smart metering, environmental monitoring, emergency alert systems, logistics tracking, portable terminals, remote monitoring equipment, agricultural automation, and machine-to-machine (M2M) communication applications</strong> requiring reliable GSM/GPRS connectivity together with integrated GNSS positioning.
MC20CE-04-SNN

Description: The MC20CE-04-SNN is a compact Quad-Band GSM/GPRS cellular commun ...
Package: TRAY | MOQ: 250 | MPQ: 250

EC200NCNLA-N05-SNNSA / The <strong>EC200NCNLA-N05-SNNSA</strong> is a compact and cost-effective <strong>LTE Category 1 cellular communication module</strong> from <strong>Quectel</strong>, specifically designed for industrial Internet of Things (IoT), machine-to-machine (M2M), smart metering, remote monitoring, payment terminals, security systems, and embedded communication equipment. As a member of the EC200N Series, it provides reliable LTE connectivity while maintaining low power consumption and a highly integrated hardware architecture suitable for mass-market IoT deployments. It supports LTE Cat 1 download speeds of up to <strong>10 Mbps</strong> and upload speeds of up to <strong>5 Mbps</strong>. The module supports <strong>LTE-FDD</strong> and <strong>LTE-TDD</strong> cellular networks and is optimized for the <strong>China and India</strong> regional markets. It provides reliable broadband wireless communication while maintaining compatibility with modern LTE infrastructure for industrial and commercial IoT applications. The EC200NCNLA-N05-SNNSA integrates a rich collection of communication interfaces including <strong>USB 2.0 High-Speed, UART, I²C, PCM digital audio, GPIO, ADC, SIM interface, RESET, PWRKEY, and RF antenna interface</strong>. Selected variants also support <strong>Bluetooth® 5.0</strong> and optional <strong>GNSS (GPS/BeiDou)</strong>, allowing developers to implement wireless connectivity and positioning functions within a single hardware platform. Operating from a <strong>3.4V to 4.5V supply voltage (3.8V typical)</strong>, the module delivers excellent RF performance while maintaining low power consumption. The compact <strong>29 × 32 × 2.4 mm LCC package</strong> supports fully automated SMT assembly, making it suitable for high-volume manufacturing. It is specified for an operating temperature range of <strong>-35°C to +75°C</strong>, with extended industrial versions supporting operation up to <strong>-40°C to +85°C</strong>. The module supports a comprehensive software ecosystem including <strong>TCP/IP, UDP, PPP, HTTP, HTTPS, FTP, MQTT, SSL/TLS, SMTP, CMUX, NTP, SMS, DFOTA (Device Firmware Over-The-Air), and standard AT commands</strong>. Drivers are available for <strong>Windows, Linux, and Android</strong>, enabling rapid integration into industrial gateways, ARM platforms, embedded Linux systems, and custom microcontroller-based products. The <strong>EC200NCNLA-N05-SNNSA</strong> is widely used in <strong>industrial IoT gateways, smart utility meters, payment terminals, POS systems, industrial automation equipment, remote telemetry units, vehicle tracking devices, security and alarm systems, environmental monitoring stations, agricultural automation, vending machines, logistics terminals, digital signage, healthcare equipment, and machine-to-machine (M2M) communication applications</strong> requiring reliable LTE Cat 1 connectivity, compact size, and long-term industrial reliability.
EC200NCNLA-N05-SNNSA

Description: The EC200NCNLA-N05-SNNSA is a compact and cost-effective LTE Cate ...
Package: TRAY | MOQ: 250 | MPQ: 250

EC200TEUHA-N06-MN0AA / The <strong>EC200TEUHA-N06-MN0AA</strong> is a high-performance <strong>LTE Category 4 cellular communication module</strong> from <strong>Quectel</strong>, designed for industrial Internet of Things (IoT), machine-to-machine (M2M), remote monitoring, smart metering, transportation, payment terminals, and embedded communication systems. As a member of the <strong>EC200T Series</strong>, it combines broadband LTE connectivity with an optimized hardware architecture, delivering reliable wireless communication for long-life industrial products. It supports LTE Cat 4 data rates of up to <strong>150 Mbps downlink</strong> and <strong>50 Mbps uplink</strong>. The <strong>EUHA</strong> regional variant is optimized for <strong>Europe</strong> and supports LTE-FDD, LTE-TDD, WCDMA, and GSM/EDGE networks, providing seamless fallback to legacy cellular technologies when LTE coverage is unavailable. This ensures dependable communication across industrial, commercial, and transportation applications throughout Europe and compatible regions. The module integrates comprehensive communication interfaces including <strong>USB 2.0 High-Speed, dual UART, I²C, SDIO, ADC, PCM digital audio, GPIO, SIM card interface, RESET, PWRKEY, NETLIGHT, and dedicated LTE main and diversity antenna connections</strong>. It supports a rich software ecosystem featuring <strong>TCP/IP, UDP, PPP, FTP, HTTP, HTTPS, MQTT, SSL/TLS, SMTP, CMUX, NTP, DFOTA (Firmware Over-The-Air), and Quectel enhanced AT commands</strong>, enabling rapid integration into cloud-connected embedded products. Operating from a <strong>3.4V to 4.5V supply voltage</strong>, the EC200TEUHA-N06-MN0AA is designed for low-power industrial operation while maintaining excellent RF performance. The compact <strong>29 × 32 × 2.4 mm LCC package</strong> supports automated SMT assembly and provides an industrial operating temperature range of <strong>-35°C to +75°C</strong>, with extended operation up to <strong>-40°C to +80°C</strong> under specified conditions. The module supports <strong>Windows, Linux, and Android</strong> through USB serial, ECM, RNDIS, and related drivers, simplifying integration with industrial computers, ARM platforms, embedded Linux gateways, and custom microcontroller-based hardware. Firmware updates can be performed through USB or remotely using DFOTA, reducing maintenance costs in field deployments. The <strong>EC200TEUHA-N06-MN0AA</strong> is widely used in <strong>industrial IoT gateways, LTE routers, smart utility meters, payment terminals, industrial automation systems, transportation equipment, security and alarm systems, remote monitoring devices, digital signage, agricultural automation, vending machines, telemetry equipment, environmental monitoring systems, edge computing platforms, and machine-to-machine (M2M) communication applications</strong> requiring reliable LTE Cat 4 connectivity and long-term industrial reliability.
EC200TEUHA-N06-MN0AA

Description: The EC200TEUHA-N06-MN0AA is a high-performance LTE Category 4 cel ...
Package: TRAY | MOQ: 250 | MPQ: 250

EC200AEUHA-N06-SNASA / The <strong>EC200AEUHA-N06-SNASA</strong> is a high-performance <strong>LTE Category 4 cellular communication module</strong> from <strong>Quectel</strong>, specifically developed for industrial Internet of Things (IoT), machine-to-machine (M2M), smart metering, transportation, security, remote monitoring, and embedded networking applications. As a member of the EC200A Series, it delivers reliable broadband cellular connectivity in a compact surface-mount package optimized for industrial deployments. It supports LTE Cat 4 download speeds of up to <strong>150 Mbps</strong> and upload speeds of up to <strong>50 Mbps</strong>. The <strong>EUHA</strong> variant is optimized for <strong>EMEA and Southeast Asia</strong> and supports LTE-FDD Bands <strong>B1/B3/B5/B7/B8/B20/B28</strong>, LTE-TDD Bands <strong>B38/B40/B41</strong>, WCDMA Bands <strong>B1/B5/B8</strong>, and GSM/EDGE Bands <strong>B3/B8</strong>. Backward compatibility with 3G and 2G networks ensures dependable communication in areas where LTE coverage is limited. The module provides a comprehensive set of interfaces including <strong>USB 2.0 High-Speed, UART, SPI, I²C, SDIO, ADC, PCM digital audio, GPIO, SIM interface, NETLIGHT, RESET, and PWRKEY</strong>. These interfaces allow seamless integration with ARM processors, embedded Linux systems, industrial controllers, and custom microcontroller-based hardware. It also supports standard AT commands and protocol stacks including <strong>TCP/IP, UDP, HTTP, HTTPS, FTP, MQTT, PPP, SSL/TLS, CMUX, DFOTA, audio playback, and voice services</strong>, significantly reducing software development time. Operating from a <strong>3.4V to 4.5V supply voltage</strong>, the EC200AEUHA-N06-SNASA is designed for low-power industrial operation with sleep current in the microamp range. The compact <strong>29 × 32 × 2.4 mm LCC package</strong> supports automated SMT assembly, while the industrial operating temperature range of <strong>-35°C to +75°C</strong> (extended versions up to <strong>-40°C to +85°C</strong>) ensures reliable performance in demanding environments. The module supports <strong>Windows, Linux, Android, OpenWrt, and embedded operating systems</strong> through USB networking interfaces and serial AT commands. Multiple USB networking modes, firmware-over-the-air updates, and industrial-grade software support make it suitable for long-life connected products deployed in commercial and industrial environments. The <strong>EC200AEUHA-N06-SNASA</strong> is widely used in <strong>industrial IoT gateways, LTE routers, smart utility meters, remote monitoring systems, payment terminals, digital signage, industrial automation, transportation systems, security equipment, vending machines, agricultural automation, telemetry units, edge computing platforms, environmental monitoring devices, and machine-to-machine (M2M) communication applications</strong> requiring reliable LTE Cat 4 connectivity and long-term industrial reliability.
EC200AEUHA-N06-SNASA

Description: The EC200AEUHA-N06-SNASA is a high-performance LTE Category 4 cel ...
Package: TRAY | MOQ: 250 | MPQ: 250

EG25GGC-MINIPCIE / The <strong>EG25GGC-MINIPCIE</strong> is a high-performance <strong>LTE Category 4 Mini PCIe cellular communication module</strong> from <strong>Quectel</strong>, specifically designed for industrial Internet of Things (IoT), machine-to-machine (M2M), transportation, networking, remote monitoring, and embedded communication systems. Built in the industry-standard <strong>Mini PCI Express</strong> form factor, it allows rapid integration into industrial routers, gateways, embedded computers, and networking equipment while providing reliable worldwide cellular connectivity. It supports LTE Cat 4 data rates of up to <strong>150 Mbps downlink</strong> and <strong>50 Mbps uplink</strong>. The module is fully backward compatible with <strong>UMTS/HSPA+</strong> and <strong>GSM/GPRS/EDGE</strong> networks, ensuring continuous communication even in areas where LTE coverage is unavailable. The <strong>EG25-GGC</strong> regional variant is optimized for deployment across global LTE networks, making it suitable for internationally deployed industrial products. Integrated <strong>multi-constellation GNSS</strong> supports <strong>GPS, GLONASS, BeiDou (BDS), Galileo, and QZSS</strong>, enabling accurate positioning, navigation, and timing without requiring an external GNSS receiver. This integration reduces PCB complexity, minimizes BOM cost, and simplifies the development of tracking, telematics, fleet management, and navigation-enabled products. The EG25GGC-MINIPCIE provides a comprehensive set of interfaces including <strong>USB 2.0 High-Speed, UART, I²C, PCM digital audio, USIM interface, network status indication, RF disable control, hardware reset, and dedicated LTE diversity and GNSS antenna connectors</strong>. It also supports a rich protocol stack including <strong>TCP/IP, UDP, PPP, FTP, HTTP, HTTPS, MQTT, SMTP, SSL/TLS, NTP, DFOTA, and Quectel enhanced AT commands</strong>, allowing rapid integration into cloud-connected embedded systems. Operating from a <strong>3.0V to 3.6V supply voltage (3.3V typical)</strong>, the module is optimized for low power consumption while maintaining excellent RF performance. The standard <strong>51.0 × 30.0 × 4.9 mm Mini PCIe form factor</strong> supports direct installation into compatible Mini PCIe sockets, while the extended operating temperature range of up to <strong>-40°C to +80°C</strong> makes it suitable for demanding industrial environments. The module is supported by <strong>Windows, Linux, and Android</strong> USB drivers and is compatible with industrial computers, ARM-based embedded systems, networking equipment, and custom hardware platforms. Support for LTE MIMO technology improves data throughput and communication reliability, making the module suitable for broadband IoT applications. The <strong>EG25GGC-MINIPCIE</strong> is widely used in <strong>industrial LTE routers, IoT gateways, vehicle telematics, fleet management systems, remote monitoring equipment, digital signage, industrial PCs, rugged tablets, payment terminals, smart transportation, agricultural automation, security systems, vending machines, edge computing platforms, and machine-to-machine (M2M) communication applications</strong> requiring reliable LTE Cat 4 connectivity together with optional integrated GNSS positioning.
EG25GGC-MINIPCIE

Description: The EG25GGC-MINIPCIE is a high-performance LTE Category 4 Mini PC ...
Package: TRAY | MOQ: 100 | MPQ: 100

RM520NGLAA-M20-SGASA / The <strong>RM520NGLAA-M20-SGASA</strong> is a high-performance <strong>5G NR Sub-6 GHz cellular communication module</strong> from <strong>Quectel</strong>, developed for next-generation industrial IoT, edge computing, enterprise networking, fixed wireless access (FWA), transportation, robotics, and high-speed machine-to-machine (M2M) applications. Built on the industry-standard <strong>M.2 3052 (Key B)</strong> form factor, it enables easy integration into routers, industrial PCs, embedded computers, and networking equipment while providing ultra-fast 5G connectivity. The module supports both <strong>5G Standalone (SA)</strong> and <strong>Non-Standalone (NSA)</strong> network architectures, delivering peak download speeds of up to <strong>2.4 Gbps</strong> and upload speeds of up to <strong>900 Mbps</strong>. It also provides backward compatibility with <strong>LTE, WCDMA, and other legacy cellular networks</strong>, ensuring uninterrupted communication where 5G coverage is unavailable. Integrated <strong>multi-constellation GNSS</strong> supports <strong>GPS, GLONASS, Galileo, BeiDou, and QZSS</strong>, enabling accurate positioning, navigation, and timing for fleet management, autonomous systems, asset tracking, and industrial automation without requiring an external positioning receiver. The RM520NGLAA-M20-SGASA provides a comprehensive range of hardware interfaces including <strong>USB 3.1, PCIe, UART, SPI, I²C, PCM/I²S audio, ADC, GPIO, SD card interface, and multiple RF antenna connections</strong>. These interfaces allow seamless integration with ARM processors, x86 industrial computers, embedded Linux platforms, networking appliances, and custom hardware designs. Operating from a <strong>3.135V to 4.4V supply voltage</strong>, the module is optimized for high-speed data communication while maintaining excellent RF performance and industrial reliability. The compact <strong>52 × 30 × 2.3 mm M.2 package</strong> simplifies system design and enables rapid deployment in high-performance embedded platforms. The module supports a broad software ecosystem including <strong>Linux, Windows, Android, USB networking modes, AT commands, TCP/IP protocol stack, MQTT, HTTP, HTTPS, FTP, SSL/TLS, and firmware-over-the-air (FOTA) updates</strong>. These capabilities reduce development time and simplify cloud integration for industrial and commercial applications. The <strong>RM520NGLAA-M20-SGASA</strong> is widely used in <strong>5G industrial gateways, enterprise routers, fixed wireless access (FWA) equipment, edge AI computers, industrial IoT controllers, autonomous robots, smart transportation systems, video surveillance, telemedicine devices, smart factories, agricultural automation, remote monitoring equipment, digital signage, private 5G networks, and high-speed embedded communication systems</strong> requiring reliable multi-gigabit wireless connectivity together with integrated GNSS positioning.
RM520NGLAA-M20-SGASA

Description: The RM520NGLAA-M20-SGASA is a high-performance 5G NR Sub-6 GHz ce ...
Package: TRAY | MOQ: 100 | MPQ: 100

EG95EFB-512-SNND / The <strong>EG95EFB-512-SNND</strong> is a high-performance <strong>LTE Category 4 cellular communication module</strong> from <strong>Quectel</strong>, engineered for industrial Internet of Things (IoT), machine-to-machine (M2M), transportation, security, remote monitoring, and embedded communication systems. Combining high-speed LTE connectivity with integrated multi-constellation GNSS positioning, the module delivers reliable wireless communication and accurate location services in a compact surface-mount package. It supports LTE Cat 4 download speeds of up to <strong>150 Mbps</strong> and upload speeds of up to <strong>50 Mbps</strong>. The module provides backward compatibility with <strong>UMTS/WCDMA, HSPA+, EDGE, and GSM/GPRS</strong> networks, ensuring dependable operation in areas where LTE coverage is limited. The <strong>EG95-EF</strong> regional variant is optimized for deployment across Europe, the Middle East, Africa, and other supported markets, making it suitable for globally distributed industrial products. Integrated <strong>multi-constellation GNSS</strong> supports <strong>GPS, GLONASS, Galileo, BeiDou, and QZSS</strong>, enabling precise positioning, navigation, and timing without requiring an external GNSS receiver. This reduces PCB area, lowers BOM cost, and simplifies the development of tracking, fleet management, and navigation-enabled IoT devices. The EG95EFB-512-SNND features comprehensive hardware interfaces including <strong>USB 2.0 High-Speed, UART, SPI, I²C, PCM digital audio, GPIO, and USIM</strong>, providing seamless integration with ARM processors, embedded Linux platforms, industrial controllers, and custom microcontroller-based systems. It supports standard AT commands together with TCP/IP, UDP, HTTP, HTTPS, FTP, MQTT, SSL/TLS, PPP, SMS, voice, and firmware update capabilities, enabling rapid development of cloud-connected products. Operating from a <strong>3.3V to 4.3V supply voltage (3.8V typical)</strong>, the module is optimized for industrial reliability while maintaining low power consumption. The compact <strong>29 × 25 × 2.3 mm LGA package</strong> supports automated SMT assembly and is specified for an operating temperature range of <strong>-35°C to +75°C</strong>, making it suitable for demanding industrial environments. The module is supported by <strong>Windows, Linux, and Android</strong> operating systems and offers multiple USB networking modes for straightforward integration into industrial computers, LTE gateways, routers, edge computing devices, and embedded systems. Its mature software ecosystem and extensive protocol support simplify deployment in professional communication equipment. The <strong>EG95EFB-512-SNND</strong> is widely used in <strong>industrial IoT gateways, vehicle telematics, GPS tracking systems, fleet management, smart utility meters, payment terminals, industrial automation, transportation systems, security equipment, remote monitoring devices, digital signage, agricultural automation, medical communication equipment, smart city infrastructure, and machine-to-machine (M2M) communication applications</strong> requiring reliable LTE Cat 4 connectivity with integrated GNSS positioning.
EG95EFB-512-SNND

Description: The EG95EFB-512-SNND is a high-performance LTE Category 4 cellula ...
Package: TRAY | MOQ: 250 | MPQ: 250

EC800MCNGD-I03-SGNSA / The <strong>EC800MCNGD-I03-SGNSA</strong> is an ultra-compact <strong>LTE Category 1 wireless communication module</strong> from <strong>Quectel</strong>, specifically engineered for cost-sensitive IoT and machine-to-machine (M2M) applications. It combines reliable LTE connectivity, integrated multi-constellation GNSS positioning, rich communication interfaces, and a highly compact footprint, making it ideal for embedded systems where PCB space is limited. It supports LTE Cat 1 data rates of up to <strong>10 Mbps downlink</strong> and <strong>5 Mbps uplink</strong>. The module is designed using a compact <strong>LCC + LGA package measuring only 17.7 × 15.8 × 2.4 mm</strong>, allowing straightforward SMT assembly while maintaining compatibility with other Quectel EC800 family modules. Its small size and unified footprint simplify hardware migration between product variants and reduce overall PCB redesign effort. The <strong>SGNSA</strong> variant integrates <strong>multi-constellation GNSS</strong> supporting <strong>GPS, BeiDou (BDS), GLONASS, and Galileo</strong>, providing accurate positioning, navigation, and timing for location-aware IoT products without requiring an external GNSS receiver. This integration minimizes BOM cost while improving system reliability and reducing PCB area. The EC800MCNGD-I03-SGNSA supports numerous industrial interfaces including <strong>USB 2.0 High-Speed, UART, I²C, ADC, GPIO, dual USIM support (optional), PCM digital audio (optional), NET_STATUS, RESET, PWRKEY, and dedicated RF interfaces</strong>. Support for USB virtual COM drivers on <strong>Windows, Linux, and Android</strong> enables rapid software integration into embedded platforms. Operating from a <strong>3.4V to 4.3V supply voltage (3.8V typical)</strong>, the module incorporates extensive Internet protocol stacks and advanced software features including <strong>TCP/IP, MQTT, HTTP, HTTPS, FTP, SSL/TLS, DFOTA (Device Firmware Over-The-Air), Wi-Fi Scan positioning, and optional QuecOpen® support</strong>. These capabilities significantly simplify cloud connectivity and remote device management for industrial deployments. Designed for industrial IoT applications, the module provides low power consumption, excellent RF performance, and long-term operational reliability. Laser marking technology improves traceability while enhancing resistance to wear during automated manufacturing processes. Compatibility with the EC800E-CN, EC800G-CN, EC800N-CN, EC800K-CN, and EG800K module families further simplifies product upgrades and lifecycle management. The <strong>EC800MCNGD-I03-SGNSA</strong> is widely used in <strong>asset tracking devices, industrial IoT gateways, POS terminals, smart security systems, vehicle telematics, remote monitoring equipment, industrial handheld terminals, smart metering, payment terminals, fleet management systems, environmental monitoring devices, agricultural automation, intelligent transportation, logistics tracking, and embedded M2M communication applications</strong> requiring compact size, reliable LTE Cat 1 connectivity, and integrated GNSS positioning.
EC800MCNGD-I03-SGNSA

Description: The EC800MCNGD-I03-SGNSA is an ultra-compact LTE Category 1 wirel ...
Package: TRAY | MOQ: 250 | MPQ: 250

EG91EFB-512-SNND / The <strong>EG91EFB-512-SNND</strong> is a compact <strong>LTE Category 1 cellular communication module</strong> from <strong>Quectel</strong>, engineered for industrial Internet of Things (IoT), machine-to-machine (M2M), telemetry, smart metering, asset tracking, security systems, and embedded communication applications. The module combines reliable LTE connectivity with integrated multi-constellation GNSS positioning, making it an excellent solution for devices requiring both wireless communication and location awareness. Supporting <strong>LTE Cat 1</strong> technology, the module delivers download speeds of up to <strong>10 Mbps</strong> and upload speeds of up to <strong>5 Mbps</strong>. It also maintains backward compatibility with <strong>UMTS/WCDMA</strong> and <strong>GSM/GPRS/EDGE</strong> networks, ensuring dependable operation in regions where LTE coverage is unavailable. LTE Cat 1 provides an ideal balance between bandwidth, power consumption, and deployment cost for industrial IoT products. Integrated <strong>GNSS</strong> functionality supports <strong>GPS, GLONASS, Galileo, BeiDou, and QZSS</strong>, enabling accurate positioning, navigation, and timing without the need for an external GNSS receiver. This integration simplifies hardware design while reducing PCB area and overall system cost. The module offers a comprehensive set of hardware interfaces including <strong>USB 2.0, UART, SPI, I²C, PCM audio, GPIO, ADC, USIM, and dual RF antenna ports</strong>. It supports standard AT commands together with TCP/IP, UDP, HTTP, HTTPS, FTP, MQTT, PPP, SSL/TLS, SMS, voice, and firmware update capabilities, enabling rapid integration into cloud-connected embedded systems. Operating from a <strong>3.3V to 4.3V supply voltage</strong>, the EG91EFB-512-SNND is optimized for low-power operation while maintaining reliable performance in industrial environments. Its compact <strong>29 × 25 × 2.2 mm LGA package</strong> supports automated SMT assembly, and the industrial operating temperature range of <strong>-35°C to +75°C</strong> makes it suitable for demanding applications. The module is supported by drivers for <strong>Linux, Android, and Windows</strong> and is compatible with a wide range of ARM processors, embedded Linux platforms, industrial controllers, and custom microcontroller-based systems. Support for multiple USB networking modes enables straightforward integration into gateways, routers, and industrial communication equipment. The <strong>EG91EFB-512-SNND</strong> is widely used in <strong>industrial IoT gateways, smart utility meters, fleet management systems, GPS tracking devices, alarm and security panels, payment terminals, vending machines, agricultural monitoring equipment, transportation systems, remote telemetry units, healthcare devices, smart city infrastructure, environmental monitoring systems, industrial automation, and machine-to-machine (M2M) communication applications</strong> requiring reliable LTE Cat 1 connectivity with integrated GNSS positioning.
EG91EFB-512-SNND

Description: The EG91EFB-512-SNND is a compact LTE Category 1 cellular communi ...
Package: TRAY | MOQ: 250 | MPQ: 250

EC25EUXGR-128-SGNS / The <strong>EC25EUXGR-128-SGNS</strong> is a compact, high-performance <strong>LTE Category 4 cellular communication module</strong> from <strong>Quectel</strong>, designed for industrial IoT, machine-to-machine (M2M), remote monitoring, transportation, security, and embedded networking applications. As a member of the proven <strong>EC25 Series</strong>, it delivers reliable global cellular connectivity together with integrated multi-constellation GNSS positioning in a compact LCC package. The module supports <strong>LTE Cat 4</strong> with download speeds of up to <strong>150 Mbps</strong> and upload speeds of up to <strong>50 Mbps</strong>. It is fully backward compatible with <strong>DC-HSPA+, HSPA+, WCDMA, EDGE, and GSM/GPRS</strong> networks, ensuring dependable communication even in areas where LTE coverage is unavailable. The <strong>EC25-EUX</strong> variant is optimized for Europe, the Middle East, Africa, and other supported LTE regions. Integrated <strong>GNSS positioning</strong> supports <strong>GPS, GLONASS, Galileo, BeiDou, and QZSS</strong>, allowing accurate real-time positioning, navigation, and timing without requiring a separate positioning receiver. This integration reduces PCB space, lowers system cost, and simplifies product development for tracking and location-aware applications. The EC25EUXGR-128-SGNS provides multiple hardware interfaces including <strong>USB 2.0 High-Speed, UART, PCM audio, I²C, USIM, ADC, GPIO, and dual LTE antenna connections</strong>, enabling straightforward integration with embedded processors, ARM platforms, industrial controllers, Linux gateways, and custom microcontroller-based systems. Support for standard AT commands, TCP/IP, UDP, HTTP, HTTPS, FTP, MQTT, SSL/TLS, PPP, SMS, voice, and FOTA allows rapid deployment in connected IoT products. Designed for industrial operation, the module operates from a <strong>3.3V–4.3V supply (3.8V nominal)</strong> and supports an operating temperature range of <strong>-35°C to +75°C</strong>, with extended industrial versions supporting up to <strong>-40°C to +85°C</strong>. The compact <strong>32 × 29 × 2.4 mm LCC package</strong> is optimized for automated SMT assembly and long-term field reliability. The EC25 Series is supported by comprehensive software drivers for <strong>Windows, Linux, and Android</strong>, making integration into industrial computers, routers, gateways, and embedded systems straightforward. It is compatible with multiple USB networking modes including NDIS, ECM, MBIM, and QMI depending on the target operating system and firmware configuration. The <strong>EC25EUXGR-128-SGNS</strong> is widely used in <strong>industrial IoT gateways, vehicle telematics, fleet management systems, GPS tracking devices, smart metering, industrial automation, security systems, payment terminals, digital signage, remote monitoring equipment, agricultural automation, transportation systems, medical devices, smart city infrastructure, edge computing platforms, and machine-to-machine (M2M) communication applications</strong> requiring reliable LTE Cat 4 connectivity together with integrated GNSS positioning.
EC25EUXGR-128-SGNS

Description: The EC25EUXGR-128-SGNS is a compact, high-performance LTE Categor ...
Package: TRAY | MOQ: 250 | MPQ: 250

EC25EUXGR-MINIPCIE / The <strong>EC25EUXGR-MINIPCIE</strong> is a high-performance <strong>LTE Category 4 Mini PCIe cellular communication module</strong> from <strong>Quectel</strong>, designed for industrial IoT, machine-to-machine (M2M), networking equipment, remote monitoring, transportation, and embedded communication applications. Utilizing the industry-standard <strong>Mini PCI Express</strong> form factor, the module can be integrated directly into routers, industrial computers, gateways, kiosks, and embedded systems with minimal hardware design effort. The module supports <strong>LTE Cat 4</strong> wireless communication with download speeds of up to <strong>150 Mbps</strong> and upload speeds of up to <strong>50 Mbps</strong>. It also provides seamless fallback to <strong>DC-HSPA+, HSPA+, WCDMA, EDGE, and GSM/GPRS</strong> networks, ensuring reliable connectivity even in areas where LTE service is unavailable. The EC25-EUX regional version is optimized for operation across Europe, the Middle East, Africa, and other supported LTE networks. The EC25EUXGR-MINIPCIE offers comprehensive connectivity through <strong>USB 2.0 High-Speed</strong>, <strong>UART</strong>, <strong>I²C</strong>, <strong>PCM digital audio</strong>, SIM card interface, WWAN status indicators, hardware reset, and RF disable control. It supports standard TCP/IP networking as well as PPP, FTP, HTTP, HTTPS, SSL/TLS, MQTT, SMS, voice, DFOTA firmware updates, and Quectel software services for efficient cloud connectivity. Operating from a <strong>3.0V to 3.6V supply voltage (3.3V typical)</strong>, the module is optimized for low power consumption while maintaining reliable operation in demanding environments. Typical sleep current is significantly reduced in the EUX version, making it well suited for energy-efficient industrial and IoT equipment. The industrial operating temperature range extends from <strong>-35°C to +75°C</strong>, with an extended option supporting <strong>-40°C to +80°C</strong>. The module is supplied on a <strong>full-size Mini PCIe card measuring 30.0 × 51.0 × 4.9 mm</strong>, enabling simple installation into standard Mini PCIe sockets. It is compatible with <strong>Windows 8/10/11, Linux (2.6–6.x), and Android</strong>, and supports multiple USB networking modes including NDIS, MBIM, QMI, GobiNet, and QMI_WWAN drivers for rapid software integration. The <strong>EC25EUXGR-MINIPCIE</strong> is widely used in <strong>industrial IoT gateways, LTE routers, industrial PCs, remote monitoring systems, smart metering, digital signage, transportation equipment, security systems, POS terminals, agricultural automation, smart city infrastructure, vending machines, edge computing platforms, telemetry devices, and machine-to-machine (M2M) communication applications</strong> requiring reliable high-speed LTE connectivity in a standard Mini PCIe format.
EC25EUXGR-MINIPCIE

Description: The EC25EUXGR-MINIPCIE is a high-performance LTE Category 4 Mini ...
Package: TRAY | MOQ: 100 | MPQ: 100

EG25GGB-MINIPCIE / The EG25GGB-MINIPCIE is a high-performance <strong>LTE Category 4 Mini PCIe cellular communication module</strong> from <strong>Quectel</strong>, designed for industrial IoT, wireless networking, transportation, remote monitoring, and embedded communication systems. Based on the industry-standard <strong>Mini PCI Express (Mini PCIe)</strong> form factor, it enables rapid integration into routers, gateways, industrial PCs, kiosks, and embedded computing platforms while delivering reliable global cellular connectivity. The module supports <strong>LTE Cat 4</strong> data rates of up to <strong>150 Mbps download</strong> and <strong>50 Mbps upload</strong>. It also provides backward compatibility with <strong>DC-HSDPA, HSPA+, WCDMA, EDGE, and GSM/GPRS</strong> networks, allowing seamless operation across regions with varying cellular infrastructure. Global frequency band support makes the module suitable for worldwide deployments. Integrated <strong>multi-constellation GNSS</strong> functionality supports <strong>GPS, GLONASS, BeiDou, Galileo, and QZSS</strong>, providing accurate positioning, navigation, and timing capabilities for fleet management, asset tracking, navigation terminals, and location-based IoT applications. The EG25GGB-MINIPCIE communicates through a <strong>USB 2.0 High-Speed interface</strong> while exposing additional interfaces including <strong>UART, I²C, PCM digital audio, SIM card interface, status LEDs, reset, RF disable, and multiple antenna connections for LTE diversity and GNSS</strong>. Support for TCP/IP networking, PPP, FTP, HTTP, HTTPS, MQTT, SSL/TLS, NTP, SMTP, and additional networking protocols simplifies integration into cloud-connected embedded systems. Operating from a <strong>3.0V to 3.6V supply (3.3V typical)</strong>, the module is optimized for low-power operation while maintaining industrial-grade reliability. It supports an operating temperature range of <strong>-35°C to +75°C</strong> with an extended temperature option reaching <strong>-40°C to +80°C</strong>, making it suitable for demanding industrial environments. The full-size <strong>Mini PCIe</strong> form factor measures approximately <strong>51.0 mm × 30.0 mm × 4.9 mm</strong>, allowing direct installation into standard Mini PCIe sockets commonly found in industrial computers, networking equipment, and embedded platforms. The module supports Linux, Android, and Windows operating systems and is compatible with a wide range of embedded processors and industrial controllers. The <strong>EG25GGB-MINIPCIE</strong> is widely used in <strong>industrial IoT gateways, 4G routers, industrial PCs, edge computing devices, transportation systems, fleet management, smart metering, vending machines, digital signage, remote monitoring equipment, payment terminals, wireless POS systems, security systems, medical equipment, smart city infrastructure, agricultural automation, and machine-to-machine (M2M) communication applications</strong> requiring reliable LTE connectivity with integrated GNSS positioning.
EG25GGB-MINIPCIE

Description: The EG25GGB-MINIPCIE is a high-performance LTE Category 4 Mini PCIe cellular commu ...
Package: TRAY | MOQ: 100 | MPQ: 100

EG25GGB-256-SGNS / The EG25GGB-256-SGNS is a high-performance <strong>LTE Cat 4 cellular communication module</strong> from <strong>Quectel</strong>, developed for industrial IoT, telematics, asset tracking, smart gateways, transportation, and embedded communication systems. Combining high-speed LTE connectivity with integrated multi-constellation GNSS positioning, the module provides a compact and reliable solution for connected devices requiring both wireless communication and precise location services. <br><br> The module supports <strong>LTE Cat 4</strong> with download speeds of up to <strong>150Mbps</strong> and upload speeds of up to <strong>50Mbps</strong>. It also provides full backward compatibility with <strong>UMTS/HSPA+</strong> and <strong>GSM/GPRS/EDGE</strong> networks, ensuring dependable operation in regions where LTE coverage may be limited. Integrated <strong>multi-constellation GNSS</strong> support includes <strong>GPS, GLONASS, Galileo, BeiDou, and QZSS</strong>, enabling fast positioning, high location accuracy, and reliable navigation for mobile and fixed wireless applications. The combined communication and positioning capabilities simplify hardware design while reducing overall system cost. The EG25GGB-256-SGNS operates from a <strong>3.3V to 4.3V supply voltage</strong> and integrates a powerful LTE modem platform capable of maintaining stable wireless communication in demanding industrial environments. Optimized RF performance, excellent receiver sensitivity, and output power up to <strong>33dBm</strong> help maximize network coverage and communication reliability. The module provides multiple communication interfaces including <strong>USB 2.0, UART, I²C, and PCM</strong>, allowing seamless integration with microcontrollers, embedded Linux systems, industrial computers, ARM processors, and custom hardware platforms. Support for voice, SMS, packet data, and GNSS functions enables development of complete wireless communication solutions. Designed for industrial deployment, the EG25GGB-256-SGNS supports an operating temperature range of approximately <strong>-35°C to +75°C</strong> and utilizes a compact <strong>LGA package measuring approximately 32mm × 29mm × 2.4mm</strong>. The module is optimized for automated SMT assembly and offers excellent long-term reliability in demanding environments. Built around Qualcomm's proven LTE modem architecture, the module supports secure data communication, low-latency networking, and efficient power management, making it suitable for always-connected IoT devices and industrial communication systems. Its global network compatibility simplifies product deployment across multiple regions. The <strong>EG25GGB-256-SGNS</strong> is widely used in <strong>vehicle telematics, fleet management systems, industrial IoT gateways, remote monitoring equipment, asset tracking devices, smart meters, payment terminals, transportation systems, security equipment, agricultural automation, smart city infrastructure, medical communication devices, and embedded LTE communication applications</strong> requiring reliable global cellular connectivity and integrated GNSS positioning.
EG25GGB-256-SGNS

Description: The EG25GGB-256-SGNS is a high-performance LTE Cat 4 cellular communication module ...
Package: TRAY | MOQ: 250 | MPQ: 250

EP4CE6E22C8N / The EP4CE6E22C8N is a versatile <strong>Field Programmable Gate Array (FPGA)</strong> from <strong>Altera (Intel FPGA)</strong>, belonging to the popular <strong>Cyclone® IV E family</strong>. Designed for cost-sensitive embedded systems, industrial automation, communications, consumer electronics, and digital signal processing applications, it delivers an excellent combination of logic density, low power consumption, and design flexibility. <br><br> The device integrates <strong>6,272 logic elements (LEs)</strong>, approximately <strong>276 Kbits of embedded RAM</strong>, and up to <strong>91 user I/O pins</strong>, providing sufficient resources for implementing complex digital logic, communication interfaces, control systems, and custom hardware accelerators. Its architecture enables designers to replace multiple discrete logic devices with a single programmable solution. <br><br> Built on an optimized low-power process technology, the EP4CE6E22C8N operates with a <strong>core voltage of 1.2V</strong>, offering excellent energy efficiency while maintaining reliable high-speed performance. The FPGA also incorporates <strong>two integrated PLLs</strong> for flexible clock generation, clock multiplication, clock division, and clock management across complex digital designs. <br><br> The Cyclone® IV E architecture includes dedicated <strong>embedded memory blocks, hardware multipliers, DSP resources, and configurable logic array blocks (LABs)</strong>, allowing efficient implementation of digital filters, motor control algorithms, communication protocols, image processing, and real-time signal processing applications. <br><br> The EP4CE6E22C8N supports numerous industry-standard interfaces including <strong>SPI, I²C, UART, SDRAM, DDR memory interfaces, GPIO, LVDS, and custom parallel communication buses</strong>. Its flexible I/O architecture enables straightforward integration with microcontrollers, processors, sensors, displays, and external peripherals. <br><br> Compatible with <strong>Intel® Quartus® Prime Lite and Standard Edition</strong> development software, the FPGA supports VHDL, Verilog, SystemVerilog, and schematic-based design entry. Designers can implement custom logic, soft-core processors, communication controllers, and digital signal processing functions while taking advantage of a mature development ecosystem. <br><br> Packaged in a compact <strong>144-pin EQFP package</strong>, the EP4CE6E22C8N offers excellent manufacturability and is suitable for automated PCB assembly while providing sufficient I/O density for a wide range of embedded applications. <br><br> The <strong>EP4CE6E22C8N</strong> is widely used in <strong>industrial automation, embedded controllers, motor control systems, communication equipment, LED display controllers, FPGA development boards, robotics, medical electronics, test and measurement instruments, digital signal processing, protocol conversion, data acquisition systems, and custom programmable logic applications</strong>.
EP4CE6E22C8N

Description: The EP4CE6E22C8N is a versatile Field Programmable Gate Array (FPGA) from ...
Package: TRAY | MOQ: 1 | MPQ: 1

10M08SAU169C8G / The 10M08SAU169C8G is a high-performance <strong>non-volatile FPGA</strong> from <strong>Altera (Intel FPGA)</strong>, belonging to the highly integrated <strong>MAX® 10 FPGA family</strong>. Designed for industrial automation, embedded control, communications, instrumentation, and intelligent interface applications, it combines programmable logic, integrated Flash memory, analog functions, and embedded processing capabilities within a single device. <br><br> The device provides approximately <strong>8,000 logic elements (LEs)</strong>, <strong>130 user I/O pins</strong>, and <strong>387 Kbits of embedded memory</strong>, offering an excellent balance of logic density and integration for medium-complexity FPGA designs. Its integrated Flash configuration memory enables <strong>instant-on operation</strong> without requiring an external configuration device, simplifying PCB design and improving system reliability. <br><br> Operating from a <strong>single 3.3V power supply architecture</strong>, the MAX® 10 family significantly reduces power sequencing complexity compared to conventional SRAM-based FPGAs. Integrated on-chip configuration storage also improves system security while reducing overall component count. <br><br> The 10M08SAU169C8G includes a built-in <strong>12-bit analog-to-digital converter (ADC)</strong>, allowing direct acquisition of analog signals for monitoring, measurement, power management, and industrial control applications without requiring an external ADC. This feature simplifies mixed-signal system design and reduces BOM cost. <br><br> Multiple <strong>PLL clock management resources</strong>, high-speed embedded memory blocks, hardware multipliers, configurable I/O standards, and advanced routing architecture enable implementation of high-performance digital signal processing, communication interfaces, and custom hardware accelerators. The device supports a wide variety of industry-standard interfaces including SPI, I²C, UART, LVDS, GPIO, and custom parallel buses. <br><br> Development is fully supported by <strong>Quartus® Prime</strong>, allowing designers to implement HDL-based designs, embedded soft processors, custom IP blocks, and digital signal processing functions. The integrated Flash architecture enables secure field updates and reliable long-term operation in embedded systems. <br><br> Packaged in a compact <strong>169-ball UBGA package</strong>, the 10M08SAU169C8G provides excellent logic density while minimizing PCB area. It is suitable for automated assembly and compact multilayer board designs requiring high I/O density. <br><br> The <strong>10M08SAU169C8G</strong> is widely used in <strong>industrial automation, motor control, embedded controllers, communication equipment, medical electronics, test and measurement instruments, FPGA-based data acquisition systems, protocol conversion, intelligent power management, robotics, factory automation, and custom digital logic applications</strong> where programmable logic, integrated Flash memory, and mixed-signal capability are required.
10M08SAU169C8G

Description: The 10M08SAU169C8G is a high-performance non-volatile FPGA from A ...
Package: TRAY | MOQ: 176 | MPQ: 176

DSPIC33EP64GS506-I/PT / The DSPIC33EP64GS506-I/PT is a high-performance <strong>16-bit Digital Signal Controller (DSC)</strong> from <strong>Microchip Technology</strong>, specifically designed for digital power conversion, motor control, switched-mode power supplies (SMPS), and real-time embedded control applications. It combines the flexibility of a microcontroller with the computational capabilities of a digital signal processor, making it an excellent solution for advanced control algorithms and high-speed signal processing. <br><br> Powered by the <strong>dsPIC33E CPU core</strong>, the device delivers up to <strong>70 MIPS</strong> of processing performance while integrating <strong>64KB Flash program memory</strong> and <strong>8KB SRAM</strong>. The architecture includes dual 40-bit accumulators, single-cycle multiply-accumulate (MAC) operations, hardware divide support, and DSP instructions that accelerate complex mathematical calculations and control loops. <br><br> The DSPIC33EP64GS506-I/PT features an advanced <strong>12-bit high-speed ADC</strong> with multiple dedicated SAR converter cores capable of conversion rates up to <strong>3.25 Msps per channel</strong>. The flexible analog subsystem includes programmable gain amplifiers, rail-to-rail comparators, integrated DACs, oversampling filters, and multiple trigger sources for precise real-time measurements. <br><br> Designed specifically for power electronics, the device incorporates <strong>five high-resolution PWM generators</strong> capable of complementary, center-aligned, push-pull, and independent output modes. PWM resolution down to <strong>1.04ns</strong>, programmable dead-time control, fault protection, and current-limit inputs make it ideal for AC/DC converters, DC/DC converters, battery chargers, inverters, PFC circuits, LED lighting, and motor drives. <br><br> The integrated communication peripherals include <strong>two UARTs, two SPI interfaces, and two I²C modules</strong>, allowing seamless communication with external sensors, memory devices, displays, and host processors. Peripheral Pin Select (PPS) technology provides flexible peripheral routing and simplifies PCB layout. <br><br> Operating from a <strong>3.0V to 3.6V supply</strong>, the device supports multiple low-power operating modes including Sleep, Idle, and Doze to reduce energy consumption in embedded applications. Integrated watchdog timer, brown-out reset, fail-safe clock monitor, and dual-partition Flash with live update capability enhance system reliability and enable firmware updates without interrupting operation. <br><br> Packaged in a compact <strong>64-pin TQFP package</strong>, the DSPIC33EP64GS506-I/PT is widely used in <strong>digital power supplies, SMPS controllers, battery management systems, motor control, renewable energy inverters, industrial automation, LED lighting systems, power factor correction (PFC), UPS equipment, robotics, and real-time embedded control applications</strong> where high-speed digital signal processing and precision analog control are required.
DSPIC33EP64GS506-I/PT

Description: The DSPIC33EP64GS506-I/PT is a high-performance 16-bit Digital Signal Controller ( ...
Package: TRAY | MOQ: 160 | MPQ: 160

MBI5030GF-C / The MBI5030GF-C is a high-performance <strong>16-channel constant-current LED driver</strong> from <strong>Macroblock</strong>, specifically designed for LED video displays, LED matrix systems, and advanced digital lighting applications. By integrating constant-current output regulation with embedded PWM control, the device provides precise LED brightness management and excellent channel-to-channel current uniformity. <br><br> The device integrates <strong>16 regulated constant-current output channels</strong> capable of driving multiple LEDs with consistent current even when LED forward voltages vary between channels. Output current can be configured through an external resistor, providing flexible current adjustment for different LED types and display requirements. <br><br> The MBI5030GF-C supports selectable <strong>16-bit or 12-bit PWM color depth control</strong>. In 16-bit mode, each output channel can generate up to <strong>65,536 grayscale levels</strong>, enabling smooth brightness transitions, accurate color reproduction, and detailed image rendering in high-quality LED display systems. <br><br> Integrated <strong>Scrambled-PWM (S-PWM) technology</strong> divides the LED on-time into multiple switching periods to effectively increase the visual refresh rate. This technology helps reduce visible flicker and improves image fidelity, particularly in LED video walls, dynamic displays, and camera-facing LED installations. <br><br> A built-in <strong>16-bit shift register</strong> receives serial image data and transfers the corresponding grayscale information to the output channels. The embedded PWM engine manages LED timing internally, reducing the timing-generation workload of the host controller and simplifying LED display control architectures. <br><br> The MBI5030GF-C provides <strong>256-step programmable global current gain control</strong>, allowing overall LED brightness to be adjusted digitally without changing the external current-setting resistor. This function enables precise panel brightness calibration and compensation across large LED display assemblies. <br><br> Integrated <strong>open-circuit LED error detection</strong> enables individual LED faults to be identified during operation. Silent error detection with low detection current supports display diagnostics while minimizing visible interference with normal image content. <br><br> Operating from a <strong>3.0V to 5.5V supply voltage range</strong>, the MBI5030GF-C is suitable for a wide variety of digital control systems. Schmitt-trigger inputs improve signal noise immunity, while high-speed serial communication supports demanding LED display data transfer requirements. <br><br> Packaged in a compact <strong>24-pin SOP package</strong>, the MBI5030GF-C is widely used in <strong>LED video walls, RGB LED displays, LED matrix panels, digital billboards, stadium displays, transportation information displays, variable message signs, advertising screens, architectural lighting systems, stage lighting equipment, and professional LED display modules</strong> requiring accurate constant-current control and high-resolution PWM dimming.
MBI5030GF-C

Description: The MBI5030GF-C is a high-performance 16-channel constant-current LED driver ...
Package: T&R | MOQ: 2000 | MPQ: 2000

NT5AD512M16H4-JR / The NT5AD512M16H4-JR is a high-performance <strong>8Gb DDR4 SDRAM memory device</strong> from <strong>Nanya Technology</strong>, designed to deliver reliable, high-speed memory performance for computing, networking, telecommunications, industrial, and embedded applications. Utilizing advanced DDR4 technology, the device provides increased bandwidth, improved signal integrity, and enhanced power efficiency for modern digital systems. <br><br> Organized as <strong>512M x 16</strong>, the NT5AD512M16H4-JR offers a total memory density of <strong>8Gb</strong> and supports data transfer rates up to <strong>3200Mbps</strong>. Its high-speed architecture enables efficient processing of memory-intensive applications while improving overall system responsiveness and throughput. <br><br> Operating from a low <strong>1.2V supply voltage</strong>, the device significantly reduces power consumption compared to earlier memory generations. This low-voltage operation helps minimize heat generation and supports energy-efficient system designs in both embedded and enterprise applications. <br><br> The DDR4 architecture incorporates advanced features such as <strong>bank group architecture, 8n prefetch operation, on-die termination (ODT), CRC error detection, ZQ calibration, and data bus inversion (DBI)</strong>. These technologies improve signal quality, enhance reliability, and support stable operation at high data rates. <br><br> Designed for high-speed synchronous operation, the NT5AD512M16H4-JR transfers data on both rising and falling clock edges, maximizing memory bandwidth while maintaining precise timing control. The architecture is optimized to support demanding workloads in networking, storage, and computing platforms. <br><br> Packaged in a compact <strong>96-ball FBGA package</strong>, the device enables high-density PCB layouts while providing excellent electrical and thermal performance. The package design supports automated assembly and integration into space-constrained electronic products. <br><br> Built for dependable long-term operation, the memory device incorporates advanced refresh management, timing control, and signal optimization mechanisms to ensure stable performance under continuous operation and demanding environmental conditions. <br><br> The <strong>NT5AD512M16H4-JR</strong> is widely used in <strong>servers, networking equipment, telecommunications infrastructure, industrial computers, embedded systems, storage controllers, edge computing devices, communication platforms, DDR4 memory modules, consumer electronics, and high-performance digital applications</strong> requiring fast, reliable, and energy-efficient memory performance.
NT5AD512M16H4-JR

Description: The NT5AD512M16H4-JR is a high-performance 8Gb DDR4 SDRAM memory device f ...
Package: T&R | MOQ: 2000 | MPQ: 2000

H5AG46DXNDX117N / The H5AG46DXNDX117N is a high-performance <strong>DDR4 SDRAM memory device</strong> from <strong>SK hynix</strong>, engineered to provide reliable high-speed memory performance for computing, industrial, networking, telecommunications, and embedded system applications. Utilizing advanced DDR4 architecture, the device delivers improved bandwidth, lower power consumption, and enhanced system efficiency compared to previous memory generations. <br><br> This memory IC provides a total density of <strong>4Gb</strong> and is optimized for applications requiring stable, high-speed data storage and retrieval. Its advanced memory architecture supports rapid data transfers, helping improve overall system responsiveness and processing efficiency. <br><br> Operating from a nominal supply voltage of <strong>1.2V</strong>, the H5AG46DXNDX117N reduces power consumption while maintaining excellent performance. The low-voltage design contributes to lower thermal output and improved energy efficiency, making it suitable for high-density electronic systems. <br><br> The DDR4 architecture incorporates advanced features such as <strong>bank group architecture, on-die termination, CRC error detection, ZQ calibration, and enhanced signal integrity mechanisms</strong>. These technologies help ensure reliable operation at high data rates while improving memory subsystem stability. <br><br> Designed for high-speed operation, the device supports double data rate transfers, enabling data transmission on both rising and falling clock edges. This architecture maximizes memory bandwidth while maintaining efficient power utilization and dependable timing performance. <br><br> Packaged in a compact <strong>FBGA package</strong>, the H5AG46DXNDX117N enables space-efficient PCB layouts while providing excellent electrical and thermal characteristics. The package is optimized for automated assembly processes and modern electronic manufacturing requirements. <br><br> Built for long-term reliability, the device incorporates advanced refresh management, timing control, and signal optimization technologies. These features help maintain stable operation in continuously operating systems and demanding computing environments. <br><br> The <strong>H5AG46DXNDX117N</strong> is widely used in <strong>embedded computing platforms, networking equipment, industrial controllers, telecommunications infrastructure, consumer electronics, storage systems, communication devices, IoT gateways, DDR4 memory modules, and high-performance digital applications</strong> requiring dependable and efficient memory performance.
H5AG46DXNDX117N

Description: The H5AG46DXNDX117N is a high-performance DDR4 SDRAM memory device from ...
Package: T&R | MOQ: 2000 | MPQ: 2000

K4A8G165WC-BCTD / The K4A8G165WC-BCTD is a high-performance <strong>8Gb DDR4 SDRAM memory device</strong> from <strong>Samsung Semiconductor</strong>, designed to deliver reliable, high-bandwidth memory performance for embedded computing, networking, industrial systems, telecommunications equipment, and server applications. Built using advanced DDR4 technology, the device provides an optimal balance of speed, capacity, and power efficiency. <br><br> Organized as <strong>512M x 16</strong>, the K4A8G165WC-BCTD offers a total memory density of <strong>8Gb</strong> and supports data transfer rates up to <strong>2666Mbps</strong>. Its high-speed architecture enables rapid data access and efficient processing of memory-intensive workloads. <br><br> Operating from a nominal supply voltage of <strong>1.2V</strong>, the device reduces power consumption and thermal generation compared to earlier memory technologies. This low-voltage operation helps improve overall system efficiency while supporting high-density memory designs. <br><br> The DDR4 architecture incorporates advanced features such as <strong>bank group architecture, dynamic on-die termination, CRC error detection, ZQ calibration, data mask functionality, and auto precharge operation</strong>. These capabilities improve signal integrity, enhance reliability, and support stable operation at high data rates. <br><br> The K4A8G165WC-BCTD utilizes Samsungs advanced <strong>C-die DDR4 technology</strong> and supports fully synchronous operation with data transfers occurring on both clock edges. This architecture maximizes memory bandwidth while maintaining efficient power utilization and stable timing performance. <br><br> Packaged in a compact <strong>96-ball FBGA package</strong>, the device enables high-density PCB layouts while providing excellent electrical and thermal characteristics. Its surface-mount package supports automated manufacturing processes and integration into space-constrained electronic systems. <br><br> Designed for long-term reliability, the memory device operates across a commercial temperature range and incorporates advanced DDR4 timing control and refresh management functions. These features help ensure dependable performance in continuously operating applications. <br><br> The <strong>K4A8G165WC-BCTD</strong> is widely used in <strong>servers, networking equipment, telecommunications infrastructure, industrial computers, embedded systems, storage controllers, edge computing devices, enterprise hardware, communication platforms, DDR4 memory modules, and high-performance digital applications</strong> requiring fast and reliable memory performance.
K4A8G165WC-BCTD

Description: The K4A8G165WC-BCTD is a high-performance 8Gb DDR4 SDRAM memory device fr ...
Package: T&R | MOQ: 2000 | MPQ: 2000

MT40A1G16TB-062E:F / The MT40A1G16TB-062E:F is a high-density <strong>16Gb DDR4 SDRAM memory device</strong> from <strong>Micron Technology</strong>, engineered to deliver reliable high-speed memory performance for enterprise, industrial, networking, telecommunications, and embedded computing applications. Built on advanced DDR4 architecture, the device offers increased memory capacity, enhanced bandwidth, and improved power efficiency for modern digital systems. <br><br> Organized as <strong>1G x 16</strong>, the MT40A1G16TB-062E:F provides a total memory density of <strong>16Gb</strong> and supports data transfer rates up to <strong>3200MT/s</strong>. The high memory density allows designers to build larger-capacity memory subsystems while reducing component count and PCB complexity. <br><br> Operating from a low <strong>1.2V supply voltage</strong>, the device significantly reduces power consumption compared to earlier memory generations. This lower operating voltage helps improve overall system efficiency while minimizing heat generation in high-density computing environments. <br><br> The DDR4 architecture incorporates advanced features such as <strong>8n prefetch operation, bank group architecture, improved command scheduling, enhanced signal integrity, and higher memory bandwidth</strong>. These technologies contribute to improved system performance and more efficient data processing. <br><br> The MT40A1G16TB-062E:F supports operating frequencies up to <strong>1600MHz</strong> and transfers data on both rising and falling clock edges, maximizing throughput while maintaining stable and reliable operation. Its architecture is optimized for applications requiring fast memory access and continuous data processing. <br><br> Packaged in a compact <strong>96-ball TFBGA package</strong>, the device enables high-density board layouts while providing excellent electrical performance and thermal characteristics. The package design supports automated manufacturing processes and efficient integration into advanced electronic systems. <br><br> Designed for long-term reliability, the memory device incorporates advanced DDR4 error management and timing control mechanisms, helping maintain stable operation under demanding workloads and extended operating periods. <br><br> The <strong>MT40A1G16TB-062E:F</strong> is widely used in <strong>servers, networking equipment, telecommunications infrastructure, industrial computers, embedded processing systems, storage controllers, edge computing devices, enterprise hardware, data center platforms, artificial intelligence systems, and high-performance digital applications</strong> requiring high-capacity, high-speed memory performance.
MT40A1G16TB-062E:F

Description: The MT40A1G16TB-062E:F is a high-density 16Gb DDR4 SDRAM memory device fr ...
Package: T&R | MOQ: 2000 | MPQ: 2000

MT40A512M16TB-062E:R / The MT40A512M16TB-062E:R is a high-performance <strong>8Gb DDR4 SDRAM memory device</strong> from <strong>Micron Technology</strong>, designed to provide fast and reliable memory performance for computing, networking, industrial, telecommunications, and embedded applications. Built on advanced DDR4 technology, the device delivers high bandwidth, low power consumption, and excellent signal integrity for demanding digital systems. <br><br> Organized as <strong>512M x 16</strong>, the MT40A512M16TB-062E:R provides a total memory density of <strong>8Gb</strong> and supports data transfer rates up to <strong>3200MT/s</strong>. This high-speed operation enables efficient handling of large data workloads while improving overall system responsiveness and performance. <br><br> Operating from a low <strong>1.2V supply voltage</strong>, the device helps reduce system power consumption and thermal generation compared to previous DDR memory generations. Its energy-efficient architecture makes it suitable for high-density memory designs and power-sensitive applications. <br><br> The DDR4 architecture incorporates advanced features including <strong>8n-prefetch architecture, bank grouping, improved command scheduling, enhanced reliability, and increased memory bandwidth</strong>. These capabilities allow the memory to efficiently support modern processors, networking devices, and embedded computing platforms. <br><br> The MT40A512M16TB-062E:R operates at a clock frequency of up to <strong>1600MHz</strong> and supports <strong>CL22 latency</strong>, providing excellent performance for high-speed memory subsystems. The device transfers data on both clock edges, maximizing throughput while maintaining stable operation. <br><br> Packaged in a compact <strong>96-ball TFBGA package</strong>, the memory device enables high-density PCB layouts while providing excellent electrical and thermal performance. Its surface-mount design supports automated assembly and integration into modern electronic products. <br><br> Designed for reliability and long-term operation, the MT40A512M16TB-062E:R supports commercial operating temperatures from <strong>0°C to +95°C</strong> and is optimized for use in systems requiring stable high-speed memory performance. <br><br> The <strong>MT40A512M16TB-062E:R</strong> is widely used in <strong>servers, networking equipment, industrial computers, telecommunications systems, embedded computing platforms, storage controllers, edge computing devices, enterprise hardware, high-performance digital systems, and DDR4 memory modules</strong> where fast and dependable memory operation is essential.
MT40A512M16TB-062E:R

Description: The MT40A512M16TB-062E:R is a high-performance 8Gb DDR4 SDRAM memory device ...
Package: T&R | MOQ: 2000 | MPQ: 2000

H5AN8G6NDJR-XNC / The H5AN8G6NDJR-XNC is a high-performance <strong>8Gb DDR4 SDRAM memory device</strong> from <strong>SK hynix</strong>, designed to provide fast and reliable memory performance for computing, networking, industrial, and embedded applications. Built using advanced DDR4 technology, the device delivers high bandwidth while maintaining low power consumption and excellent signal integrity. <br><br> Organized as <strong>512M x 16</strong>, the H5AN8G6NDJR-XNC provides a total memory density of <strong>8Gb</strong> and supports data transfer rates up to <strong>3200Mbps</strong>. This high-speed performance enables efficient handling of large data workloads and improves overall system responsiveness. <br><br> Operating from a low <strong>1.2V supply voltage</strong>, the device offers improved power efficiency compared to previous DDR memory generations. Reduced power consumption helps lower thermal output while supporting energy-efficient system designs. <br><br> The DDR4 architecture incorporates advanced features such as <strong>bank group architecture, improved command scheduling, enhanced reliability, and higher memory bandwidth</strong>. These capabilities contribute to better performance in applications requiring fast memory access and multitasking operation. <br><br> The H5AN8G6NDJR-XNC supports fully synchronous operation and transfers data on both rising and falling clock edges, maximizing data throughput while maintaining timing accuracy. Its optimized architecture is suitable for systems requiring high-capacity memory and stable operation under continuous workloads. <br><br> Packaged in a compact <strong>96-ball FBGA package</strong>, the device enables high-density PCB layouts while providing excellent electrical and thermal performance. The package design supports modern memory module manufacturing and embedded system integration. <br><br> Designed for mainstream and high-performance memory applications, the H5AN8G6NDJR-XNC delivers dependable operation across a wide range of computing environments, supporting reliable data storage and retrieval functions in demanding systems. <br><br> The <strong>H5AN8G6NDJR-XNC</strong> is widely used in <strong>DDR4 memory modules, servers, desktop computers, industrial PCs, networking equipment, telecommunications systems, embedded computing platforms, storage systems, edge computing devices, consumer electronics, and high-performance digital processing applications</strong>.
H5AN8G6NDJR-XNC

Description: The H5AN8G6NDJR-XNC is a high-performance 8Gb DDR4 SDRAM memory device fr ...
Package: T&R | MOQ: 2000 | MPQ: 2000

MZ1L23T8HBLA-00A07 / The MZ1L23T8HBLA-00A07 is a high-performance <strong>enterprise NVMe solid state drive</strong> from <strong>Samsung</strong>, part of the advanced <strong>PM9A3 series</strong> developed for hyperscale data centers, cloud computing platforms, enterprise servers, and software-defined storage environments. Designed with the modern <strong>E1.S (EDSFF) form factor</strong>, it delivers exceptional storage density, thermal efficiency, and performance for next-generation server architectures. <br><br> Featuring a storage capacity of <strong>3.84TB</strong>, the drive provides an ideal balance between capacity, performance, and endurance for enterprise applications. It is optimized for virtualization platforms, cloud-native workloads, databases, content delivery networks, analytics platforms, and large-scale storage infrastructures operating around the clock. <br><br> The MZ1L23T8HBLA-00A07 utilizes a <strong>PCIe 4.0 x4 NVMe 1.4 interface</strong>, enabling significantly higher bandwidth and lower latency than previous-generation storage technologies. The drive delivers sequential read speeds of up to <strong>6,800MB/s</strong> and sequential write speeds of up to <strong>4,000MB/s</strong>, helping accelerate data-intensive workloads and improve overall system responsiveness. <br><br> For demanding enterprise environments, the PM9A3 architecture supports random read performance of up to <strong>1,000,000 IOPS</strong> and random write performance of up to <strong>180,000 IOPS</strong>. These capabilities make it particularly effective for virtualized infrastructure, cloud services, AI data processing, enterprise databases, and transaction-heavy applications. <br><br> Built using Samsung's advanced <strong>TLC V-NAND technology</strong> and enterprise-grade controller architecture, the drive provides consistent performance and long-term reliability. The device supports approximately <strong>1 DWPD (Drive Write Per Day)</strong> endurance and is engineered for continuous 24/7 operation in mission-critical environments. <br><br> Advanced security and data protection features include <strong>AES-XTS 256-bit hardware encryption</strong>, support for <strong>TCG Opal 2.0</strong>, end-to-end data protection, error correction technologies, and enterprise-class reliability mechanisms. These features help ensure data integrity and security without compromising performance. <br><br> The compact <strong>E1.S form factor</strong> improves airflow management and storage density compared to traditional drive formats, making it particularly suitable for hyperscale server deployments where thermal optimization and space efficiency are critical requirements. <br><br> The <strong>MZ1L23T8HBLA-00A07</strong> is widely used in <strong>cloud computing infrastructure, hyperscale data centers, enterprise servers, virtualization platforms, software-defined storage systems, AI and machine learning environments, database servers, content delivery networks, edge computing systems, and mission-critical business applications</strong> requiring high-speed, scalable, and reliable enterprise storage solutions.
MZ1L23T8HBLA-00A07

Description: The MZ1L23T8HBLA-00A07 is a high-performance enterprise NVMe solid state drive ...
Package: TRAY | MOQ: 1 | MPQ: 1

MZ1L2960HCJR-00A07 / The MZ1L2960HCJR-00A07 is a high-performance <strong>enterprise NVMe solid state drive</strong> from <strong>Samsung</strong>, part of the advanced <strong>PM9A3 series</strong> designed for hyperscale data centers, cloud computing infrastructure, enterprise servers, and next-generation storage platforms. Utilizing the compact <strong>E1.S (EDSFF)</strong> form factor, it delivers outstanding storage density, thermal efficiency, and performance for modern server architectures. <br><br> Featuring a storage capacity of <strong>960GB</strong>, the drive provides a reliable storage solution for virtualization platforms, cloud-native applications, operating system deployment, caching layers, enterprise databases, and software-defined storage environments. Its architecture is optimized for continuous 24/7 enterprise operation. <br><br> The MZ1L2960HCJR-00A07 utilizes a <strong>PCIe 4.0 x4 NVMe 1.4 interface</strong>, enabling significantly higher bandwidth and lower latency compared to traditional SATA and SAS storage technologies. The drive delivers sequential read speeds of up to <strong>6,800MB/s</strong> and sequential write speeds of up to <strong>4,000MB/s</strong>, helping accelerate data-intensive workloads and improve application responsiveness. <br><br> For demanding enterprise applications, the PM9A3 architecture supports random read performance of up to <strong>1,000,000 IOPS</strong> and random write performance of up to <strong>180,000 IOPS</strong>. These capabilities make the drive highly suitable for virtualization, cloud services, analytics workloads, edge computing, and transaction-intensive server environments. <br><br> Built using Samsung's advanced <strong>TLC V-NAND technology</strong> and enterprise-grade controller architecture, the drive delivers consistent performance, excellent endurance, and long-term reliability. With support for approximately <strong>1 DWPD (Drive Write Per Day)</strong>, it is engineered to meet the requirements of professional data center deployments. <br><br> Advanced security features include <strong>AES-XTS 256-bit hardware encryption</strong>, support for <strong>TCG Opal</strong> security standards, end-to-end data protection, S.M.A.R.T. monitoring, and advanced error correction technologies. These capabilities help ensure data integrity and security in mission-critical applications. <br><br> The compact <strong>E1.S form factor</strong> improves airflow efficiency and storage density compared to traditional drive formats, making it particularly suitable for hyperscale servers and high-density storage systems where thermal management and space optimization are essential considerations. <br><br> The <strong>MZ1L2960HCJR-00A07</strong> is widely used in <strong>cloud computing infrastructure, hyperscale data centers, enterprise servers, virtualization platforms, software-defined storage systems, edge computing environments, database servers, content delivery networks, AI and analytics platforms, and mission-critical business applications</strong> requiring high-speed, reliable enterprise storage.
MZ1L2960HCJR-00A07

Description: The MZ1L2960HCJR-00A07 is a high-performance enterprise NVMe solid state drive ...
Package: TRAY | MOQ: 1 | MPQ: 1

MZ1L21T9HCLS-00A07 / The MZ1L21T9HCLS-00A07 is a high-performance <strong>enterprise NVMe solid state drive</strong> from <strong>Samsung</strong>, belonging to the advanced <strong>PM9A3 series</strong> developed for next-generation data centers, cloud computing platforms, and enterprise server environments. Utilizing the modern <strong>E1.S (EDSFF)</strong> form factor, it delivers exceptional storage density, improved thermal efficiency, and high-speed data access for demanding workloads. <br><br> Featuring a storage capacity of <strong>1.92TB</strong>, the drive is optimized for cloud infrastructure, virtualization platforms, enterprise databases, software-defined storage, and large-scale server deployments. Its enterprise-class architecture ensures consistent performance and reliability during continuous 24/7 operation. <br><br> The MZ1L21T9HCLS-00A07 utilizes a <strong>PCIe 4.0 x4 NVMe 1.4 interface</strong>, providing significantly higher bandwidth and lower latency compared to previous-generation storage technologies. The drive delivers sequential read speeds of up to <strong>6,800MB/s</strong> and sequential write speeds of up to <strong>4,000MB/s</strong>, accelerating data-intensive applications and reducing storage bottlenecks. <br><br> For enterprise and cloud workloads, the PM9A3 architecture supports random read performance of up to <strong>1,000,000 IOPS</strong> and random write performance of up to <strong>180,000 IOPS</strong>. These capabilities make the drive highly suitable for virtualization, analytics, web-scale services, and transaction-intensive computing environments. <br><br> Built using Samsung's advanced <strong>TLC V-NAND technology</strong> and enterprise-grade controller architecture, the drive provides excellent endurance and reliability. With support for approximately <strong>1 DWPD (Drive Write Per Day)</strong> and an enterprise-class reliability rating, it is designed for long-term deployment in mission-critical systems. <br><br> Security features include <strong>AES-XTS 256-bit hardware encryption</strong>, support for <strong>TCG Opal</strong> security standards, end-to-end data protection, advanced error correction technologies, and comprehensive drive management capabilities. These features help protect sensitive business data while maintaining maximum performance. <br><br> The compact <strong>E1.S form factor</strong> enables higher storage density and improved airflow compared to traditional SSD packages, making it particularly attractive for hyperscale servers and next-generation data center architectures where space efficiency and thermal management are critical. <br><br> The <strong>MZ1L21T9HCLS-00A07</strong> is widely used in <strong>cloud computing infrastructure, hyperscale data centers, enterprise servers, virtualization platforms, software-defined storage systems, database servers, content delivery networks, AI and analytics environments, edge computing platforms, and mission-critical enterprise applications</strong> where high performance, scalability, and reliability are essential.
MZ1L21T9HCLS-00A07

Description: The MZ1L21T9HCLS-00A07 is a high-performance enterprise NVMe solid state drive ...
Package: TRAY | MOQ: 1 | MPQ: 1

MZQL27T6HBLA-00A07 / The MZQL27T6HBLA-00A07 is a high-capacity <strong>enterprise NVMe solid state drive</strong> from <strong>Samsung</strong>, belonging to the advanced <strong>PM9A3 series</strong> developed for modern data centers, cloud computing platforms, enterprise servers, and high-performance storage infrastructures. Built on PCIe Gen4 technology, it delivers exceptional throughput, low latency, and enterprise-class reliability for demanding workloads. <br><br> Featuring a massive <strong>7.68TB storage capacity</strong>, this drive is optimized for large-scale virtualization environments, cloud services, enterprise databases, software-defined storage platforms, and mission-critical business applications. Its architecture is designed to maintain consistent performance under continuous 24/7 operation. <br><br> The MZQL27T6HBLA-00A07 utilizes a <strong>PCIe 4.0 x4 NVMe 1.4 interface</strong>, enabling significantly higher bandwidth than previous-generation storage solutions. The drive delivers sequential read speeds of up to <strong>6,700MB/s</strong> and sequential write speeds of up to <strong>4,000MB/s</strong>, helping eliminate storage bottlenecks in performance-sensitive environments. <br><br> For intensive enterprise workloads, the PM9A3 architecture supports random read performance of up to <strong>1,100,000 IOPS</strong> and random write performance of up to <strong>200,000 IOPS</strong>. These capabilities make the drive ideal for virtualization, analytics, cloud infrastructure, database acceleration, and large-scale transaction processing systems. <br><br> Built using Samsung's advanced <strong>V-NAND TLC technology</strong> and enterprise-grade controller architecture, the drive provides excellent endurance with approximately <strong>1 DWPD (Drive Write Per Day)</strong> and a reliability rating of up to <strong>2 million hours MTBF</strong>. These specifications support long-term deployment in demanding data center environments. <br><br> Security and data integrity features include <strong>AES-XTS 256-bit hardware encryption</strong>, <strong>TCG Opal support</strong>, end-to-end data protection, advanced error correction mechanisms, and integrated power loss protection technologies. These features help safeguard critical enterprise data while maintaining high performance. <br><br> The standard <strong>2.5-inch U.2 form factor</strong> with a 7mm profile enables seamless integration into enterprise servers, storage arrays, hyperconverged infrastructure platforms, and cloud computing systems. Optimized power efficiency and thermal performance further support high-density deployment within modern data centers. <br><br> The <strong>MZQL27T6HBLA-00A07</strong> is widely used in <strong>data centers, cloud computing infrastructure, enterprise servers, virtualization platforms, database systems, AI and analytics environments, software-defined storage solutions, content delivery networks, high-performance computing systems, and mission-critical enterprise applications</strong> where maximum storage performance, reliability, and scalability are essential.
MZQL27T6HBLA-00A07

Description: The MZQL27T6HBLA-00A07 is a high-capacity enterprise NVMe solid state drive ...
Package: TRAY | MOQ: 60 | MPQ: 60

MZQL23T8HCLS-00A07 / The MZQL23T8HCLS-00A07 is a high-performance <strong>enterprise NVMe solid state drive</strong> from <strong>Samsung</strong>, part of the advanced <strong>PM9A3 series</strong> developed for modern data centers, cloud computing platforms, enterprise servers, and storage infrastructures. Built on PCIe Gen4 technology, it delivers exceptional throughput, low latency, and enterprise-grade reliability for demanding workloads. <br><br> Featuring a storage capacity of <strong>3.84TB</strong>, the drive provides an ideal balance between performance and storage density for virtualization platforms, cloud services, enterprise databases, content delivery networks, and software-defined storage environments. Its architecture is optimized for read-intensive and mixed-use workloads operating continuously in professional environments. <br><br> The MZQL23T8HCLS-00A07 utilizes a <strong>PCIe 4.0 x4 NVMe 1.4 interface</strong>, enabling significantly higher bandwidth than previous-generation storage technologies. The drive delivers sequential read speeds of up to <strong>6,900MB/s</strong> and sequential write speeds of up to <strong>4,100MB/s</strong>, accelerating application performance and reducing storage bottlenecks. <br><br> For high-performance enterprise applications, the PM9A3 architecture supports random read performance of up to <strong>1,000,000 IOPS</strong> and random write performance of up to <strong>180,000 IOPS</strong>. These capabilities make the drive highly suitable for large-scale virtualization, cloud infrastructure, analytics workloads, and transaction-intensive systems. <br><br> Built using Samsung's advanced <strong>TLC V-NAND technology</strong> and enterprise-class controller architecture, the drive delivers consistent performance while maintaining excellent endurance. The device supports approximately <strong>1 DWPD (Drive Write Per Day)</strong> and offers a reliability rating of up to <strong>2 million hours MTBF</strong>, supporting continuous 24/7 operation. <br><br> Security features include integrated <strong>AES-XTS 256-bit hardware encryption</strong>, support for <strong>TCG Opal 2.0</strong>, end-to-end data protection, S.M.A.R.T. monitoring, and TRIM functionality. These enterprise-class features help ensure data integrity, security, and long-term storage reliability. <br><br> The standard <strong>2.5-inch U.2 form factor</strong> with a 7mm profile allows seamless integration into enterprise servers, storage arrays, and hyperconverged infrastructure platforms. Its optimized power efficiency and thermal design support high-density deployment within modern data centers. <br><br> The <strong>MZQL23T8HCLS-00A07</strong> is widely used in <strong>data centers, cloud computing infrastructure, enterprise servers, virtualization platforms, database systems, software-defined storage solutions, content delivery networks, AI and analytics environments, high-performance computing systems, and mission-critical business applications</strong> where maximum performance, security, and reliability are essential.
MZQL23T8HCLS-00A07

Description: The MZQL23T8HCLS-00A07 is a high-performance enterprise NVMe solid state drive ...
Package: TRAY | MOQ: 60 | MPQ: 60

MZQL2960HCJR-00A07 / The MZQL2960HCJR-00A07 is a high-performance <strong>enterprise NVMe solid state drive</strong> from <strong>Samsung</strong>, belonging to the advanced <strong>PM9A3 series</strong> developed for modern data centers, cloud infrastructure, enterprise servers, and storage platforms. Designed around PCIe Gen4 technology, it delivers exceptional speed, low latency, and outstanding reliability for business-critical workloads. <br><br> Featuring a storage capacity of <strong>960GB</strong>, this SSD provides a highly efficient storage solution for virtualization environments, cloud computing systems, enterprise applications, databases, and software-defined storage platforms. Its architecture is optimized for read-intensive and mixed-workload environments requiring fast and consistent access to data. <br><br> The MZQL2960HCJR-00A07 utilizes a <strong>PCIe 4.0 x4 NVMe interface</strong>, enabling significantly higher throughput compared to SATA and previous-generation PCIe storage solutions. The drive delivers sequential read speeds of up to <strong>6,800MB/s</strong> and sequential write speeds of up to <strong>4,000MB/s</strong>, accelerating application responsiveness and data processing performance. <br><br> For demanding server applications, the PM9A3 architecture supports random read performance of up to <strong>1,000,000 IOPS</strong> and random write performance of up to <strong>180,000 IOPS</strong>. These capabilities make the drive particularly effective for large-scale cloud services, virtualized environments, analytics workloads, and enterprise transaction processing systems. <br><br> Built using Samsung's advanced <strong>TLC V-NAND technology</strong> and enterprise-grade controller architecture, the drive provides excellent endurance with a rating of approximately <strong>1 DWPD</strong> and an operational life designed for continuous 24/7 deployment in professional environments. <br><br> Security is enhanced through integrated <strong>AES-XTS 256-bit hardware encryption</strong> and support for <strong>TCG Opal 2.0</strong> security standards, helping organizations protect sensitive data while maintaining high storage performance. Advanced error handling and data integrity mechanisms further improve reliability in mission-critical applications. <br><br> The standard <strong>2.5-inch U.2 form factor</strong> with a 7mm profile enables seamless integration into modern servers, storage appliances, and hyperconverged infrastructure platforms. Its optimized power efficiency and thermal characteristics support high-density deployment within enterprise data centers. <br><br> The <strong>MZQL2960HCJR-00A07</strong> is widely used in <strong>data centers, cloud computing infrastructure, enterprise servers, virtualization platforms, database systems, software-defined storage environments, content delivery networks, AI and analytics platforms, high-performance computing systems, and business-critical enterprise applications</strong> where maximum storage performance and reliability are essential.
MZQL2960HCJR-00A07

Description: The MZQL2960HCJR-00A07 is a high-performance enterprise NVMe solid state drive ...
Package: TRAY | MOQ: 60 | MPQ: 60

MZQL21T9HCJR-00A07 / The MZQL21T9HCJR-00A07 is a high-performance <strong>enterprise NVMe solid state drive</strong> from <strong>Samsung</strong>, part of the advanced <strong>PM9A3 series</strong> developed for modern data centers, cloud infrastructure, enterprise servers, and storage platforms. Built on PCIe Gen4 technology, it delivers exceptional speed, efficiency, and reliability for demanding business workloads. <br><br> Featuring a storage capacity of <strong>1.92TB</strong>, the drive provides ample space for virtualization environments, databases, cloud applications, software-defined storage systems, and enterprise computing workloads. Its architecture is optimized for read-intensive and mixed-use applications requiring low latency and consistent performance. <br><br> The MZQL21T9HCJR-00A07 utilizes a <strong>PCIe 4.0 x4 NVMe interface</strong>, enabling significantly higher throughput compared to previous-generation storage solutions. The drive delivers sequential read speeds of up to <strong>6,800MB/s</strong> and sequential write speeds of up to <strong>4,000MB/s</strong>, helping accelerate data processing and application responsiveness. <br><br> For high-performance server environments, the PM9A3 architecture supports random read performance of up to <strong>1,000,000 IOPS</strong> and random write performance of up to <strong>180,000 IOPS</strong>. These capabilities make it particularly effective for large-scale cloud computing, virtualization, analytics, and enterprise transaction processing systems. <br><br> Built with Samsung's advanced V-NAND technology and enterprise-class controller architecture, the drive provides excellent endurance with approximately <strong>1 DWPD (Drive Write Per Day)</strong> capability and enterprise-grade reliability for continuous 24/7 operation. <br><br> Security features include support for <strong>TCG Opal encryption</strong> and advanced enterprise data protection mechanisms, helping safeguard sensitive information while maintaining high performance. The drive is engineered to meet the demanding security and reliability requirements of professional IT environments. <br><br> The standard <strong>2.5-inch U.2 form factor</strong> with a 7mm profile allows seamless integration into modern servers, storage arrays, and hyperconverged infrastructure platforms. Its efficient power consumption and thermal characteristics further support high-density data center deployments. <br><br> The <strong>MZQL21T9HCJR-00A07</strong> is widely used in <strong>data centers, cloud computing infrastructure, enterprise servers, virtualization platforms, database systems, software-defined storage solutions, content delivery networks, AI data processing environments, high-performance computing systems, and business-critical enterprise applications</strong> where maximum storage performance and reliability are essential.
MZQL21T9HCJR-00A07

Description: The MZQL21T9HCJR-00A07 is a high-performance enterprise NVMe solid state drive ...
Package: TRAY | MOQ: 120 | MPQ: 120

MZ7LH1T9HMLT-00005 / The MZ7LH1T9HMLT-00005 is a high-reliability <strong>enterprise SATA solid state drive</strong> from <strong>Samsung</strong>, belonging to the proven <strong>PM883 series</strong>. Designed specifically for data center infrastructure, enterprise servers, cloud platforms, and storage systems, it delivers a balance of performance, endurance, and reliability for mission-critical workloads. <br><br> Featuring a storage capacity of <strong>1.92TB</strong>, the drive provides ample space for operating systems, virtual machines, databases, application servers, and enterprise storage environments. Its optimized architecture is engineered to maintain consistent performance under continuous 24/7 operation. <br><br> The MZ7LH1T9HMLT-00005 utilizes a <strong>SATA III 6Gb/s interface</strong> and advanced Samsung V-NAND technology to deliver reliable enterprise-class storage performance. The drive achieves sequential read speeds of up to <strong>550MB/s</strong> and sequential write speeds of up to <strong>520MB/s</strong>, enabling fast access to business-critical data. <br><br> For demanding server workloads, the PM883 architecture supports random read performance up to <strong>98,000 IOPS</strong> and random write performance up to <strong>30,000 IOPS</strong>, helping improve application responsiveness and overall system efficiency. <br><br> Security features include integrated <strong>256-bit AES hardware encryption</strong>, providing data protection without sacrificing storage performance. Support for enterprise security and data integrity functions helps safeguard sensitive information in professional environments. <br><br> Built for long-term reliability, the drive offers an endurance rating of approximately <strong>1.3 DWPD</strong> and an <strong>MTBF of 2 million hours</strong>. Advanced error correction, wear leveling, and enterprise firmware technologies contribute to dependable operation throughout the product lifecycle. <br><br> The standard <strong>2.5-inch 7mm form factor</strong> allows seamless integration into rack servers, storage appliances, and enterprise computing platforms. Low power consumption and efficient thermal characteristics further support large-scale deployment in modern data centers. <br><br> The <strong>MZ7LH1T9HMLT-00005</strong> is widely used in <strong>data centers, cloud computing platforms, virtualization servers, enterprise storage arrays, database servers, web hosting infrastructure, content delivery networks, backup systems, software-defined storage environments, and business-critical enterprise applications</strong> requiring dependable high-capacity storage.
MZ7LH1T9HMLT-00005

Description: The MZ7LH1T9HMLT-00005 is a high-reliability enterprise SATA solid state drive ...
Package: TRAY | MOQ: 120 | MPQ: 120

MZQLB7T6HMLA-00007 / The MZQLB7T6HMLA-00007 is a high-capacity <strong>enterprise NVMe solid state drive</strong> from <strong>Samsung</strong>, belonging to the widely deployed <strong>PM983 series</strong>. Designed specifically for data center, cloud computing, enterprise server, and storage infrastructure applications, it delivers a combination of high performance, reliability, and storage density for demanding workloads. <br><br> Featuring a massive <strong>7.68TB storage capacity</strong>, the drive enables efficient handling of large databases, virtualization platforms, content delivery systems, and high-volume enterprise applications. Its optimized architecture provides consistent performance under intensive read and mixed-workload environments. <br><br> The MZQLB7T6HMLA-00007 utilizes a <strong>PCIe 3.0 x4 interface with NVMe protocol</strong>, significantly reducing latency while maximizing bandwidth compared to traditional SATA-based storage solutions. The drive achieves sequential read speeds of up to <strong>3,200MB/s</strong> and sequential write speeds of up to <strong>2,000MB/s</strong>, enabling rapid access to mission-critical data. <br><br> For high-performance enterprise workloads, the PM983 architecture supports random read performance up to <strong>540K IOPS</strong>, delivering excellent responsiveness in virtualization, cloud storage, and transactional database environments. The NVMe interface helps improve overall server efficiency while reducing storage bottlenecks. <br><br> Security is enhanced through integrated <strong>256-bit AES-XTS hardware encryption</strong> and support for enterprise security standards such as <strong>TCG Opal</strong>, helping protect sensitive business data without impacting performance. <br><br> Built using Samsung's advanced V-NAND technology and enterprise-grade controller architecture, the drive offers excellent endurance with ratings of up to <strong>1.3 DWPD</strong> and a reliability specification of approximately <strong>2 million hours MTBF</strong>. These characteristics make it suitable for continuous operation in mission-critical environments. <br><br> The standard <strong>2.5-inch U.2 form factor</strong> enables easy integration into modern enterprise servers, storage arrays, and hyperconverged infrastructure platforms. Its compact design allows high storage density while maintaining efficient thermal performance. <br><br> The <strong>MZQLB7T6HMLA-00007</strong> is widely used in <strong>data centers, cloud computing infrastructure, virtualization servers, enterprise storage arrays, software-defined storage platforms, database servers, content delivery networks, AI data processing systems, high-performance computing environments, and business-critical server applications</strong>.
MZQLB7T6HMLA-00007

Description: The MZQLB7T6HMLA-00007 is a high-capacity enterprise NVMe solid state drive ...
Package: TRAY | MOQ: 120 | MPQ: 120

PIC32MX250F256H-I/PT / The PIC32MX250F256H-I/PT is a powerful <strong>32-bit microcontroller</strong> from <strong>Microchip Technology</strong>, built around the high-performance <strong>MIPS32® M4K™ processor core</strong>. Designed for embedded control, industrial automation, communication systems, and advanced human-machine interface applications, it combines high processing capability with a rich set of integrated peripherals. <br><br> Operating at frequencies up to <strong>50MHz</strong> and delivering approximately <strong>83 DMIPS performance</strong>, the device provides the computational power required for demanding real-time applications. It integrates <strong>256KB of Flash memory</strong> and <strong>32KB of SRAM</strong>, offering ample space for complex firmware and data processing tasks. <br><br> The PIC32MX250F256H-I/PT supports a wide operating voltage range of <strong>2.3V to 3.6V</strong> and incorporates multiple low-power operating modes, including Sleep and Idle modes, helping designers optimize energy consumption in portable and power-sensitive applications. <br><br> A comprehensive set of communication peripherals is integrated on-chip, including <strong>USB 2.0 Full-Speed OTG</strong>, multiple UART interfaces, SPI modules, I²C interfaces, and Peripheral Pin Select (PPS) functionality. These features simplify system integration and provide flexibility for a broad range of connectivity requirements. <br><br> The device includes advanced analog capabilities such as a <strong>10-bit ADC with up to 1 Msps conversion rate</strong>, integrated comparators, temperature sensing functions, and programmable voltage references. These features make it suitable for measurement, monitoring, and control applications. <br><br> For graphics, audio, and user-interface designs, the PIC32MX250F256H-I/PT incorporates support for <strong>touch sensing, audio communication interfaces, RTCC functionality, DMA channels, and Parallel Master Port (PMP)</strong>, enabling efficient implementation of sophisticated embedded systems. <br><br> Built-in system management features include watchdog timer, brown-out reset, power-on reset, fail-safe clock monitoring, and hardware DMA support, contributing to robust and reliable operation in industrial environments. <br><br> Packaged in a compact <strong>64-pin TQFP package</strong>, the PIC32MX250F256H-I/PT is widely used in <strong>industrial controllers, IoT gateways, consumer electronics, USB-enabled devices, HMI systems, medical instrumentation, automation equipment, data acquisition systems, communication devices, smart energy products, and embedded control platforms</strong> requiring high-performance 32-bit processing.
PIC32MX250F256H-I/PT

Description: The PIC32MX250F256H-I/PT is a powerful 32-bit microcontroller from ...
Package: TRAY | MOQ: 160 | MPQ: 160

MCP1826S-3302E/DB / The MCP1826S-3302E/DB is a high-performance <strong>low dropout (LDO) linear voltage regulator</strong> from <strong>Microchip Technology</strong>, designed to deliver stable and efficient power regulation for embedded systems, industrial electronics, communication equipment, and portable devices. Its combination of high output current capability and low dropout voltage makes it an ideal solution for modern low-voltage power architectures. <br><br> This regulator provides a fixed <strong>3.3V output voltage</strong> with output current capability up to <strong>1A</strong>, supporting a wide range of digital and analog circuits. The device operates from an input voltage range of <strong>2.3V to 6.0V</strong>, offering flexibility for battery-powered and regulated power supply applications. <br><br> The MCP1826S-3302E/DB features a low dropout voltage of typically <strong>250mV at 1A load current</strong>, enabling efficient operation even when the input voltage is only slightly higher than the regulated output voltage. This characteristic helps maximize battery life and improve overall system efficiency. <br><br> Designed for low-power applications, the regulator offers a very low <strong>quiescent current of approximately 120µA</strong>, reducing standby power consumption while maintaining excellent regulation performance. Fast transient response further ensures stable output voltage during sudden load changes. <br><br> The device is fully stable with only a <strong>1µF ceramic output capacitor</strong>, simplifying circuit design and reducing component count. Ceramic capacitor compatibility also helps achieve lower output noise and improved reliability compared to traditional regulator solutions. <br><br> Integrated protection features include <strong>overtemperature shutdown, short-circuit current limiting, and undervoltage lockout (UVLO)</strong>, providing enhanced system protection under abnormal operating conditions. These built-in safeguards contribute to long-term reliability and robust operation. <br><br> Packaged in a compact <strong>SOT-223-3 surface-mount package</strong>, the MCP1826S-3302E/DB offers efficient thermal performance and easy integration into space-constrained PCB layouts. Its wide operating temperature range of <strong>-40°C to +125°C</strong> makes it suitable for demanding industrial environments. <br><br> The <strong>MCP1826S-3302E/DB</strong> is widely used in <strong>microcontroller power supplies, industrial control systems, communication modules, IoT devices, portable electronics, battery-powered equipment, embedded computing platforms, sensor systems, instrumentation, automotive electronics, and general-purpose 3.3V power regulation applications</strong>.
MCP1826S-3302E/DB

Description: The MCP1826S-3302E/DB is a high-performance low dropout (LDO) linear voltage regul ...
Package: TUBE | MOQ: 1170 | MPQ: 78

0787270001-SIM / The 0787270001 is a compact <strong>micro-SIM card socket connector</strong> from <strong>Molex</strong>, designed to provide reliable SIM card connectivity for wireless communication devices, embedded systems, and IoT applications. Its low-profile construction and robust contact design make it an excellent solution for products requiring secure mobile network access. <br><br> This connector features a <strong>push-pull card insertion mechanism</strong> that allows easy SIM card installation and removal without the need for an ejector system. The design ensures stable card retention while simplifying user interaction and device assembly. <br><br> The 0787270001 supports standard <strong>micro-SIM card interfaces</strong> and incorporates <strong>6 signal contacts plus an integrated detect switch</strong>. The detect switch enables system-level card presence monitoring, improving device functionality and communication reliability. <br><br> With an ultra-slim profile of only <strong>1.40mm height above the PCB</strong>, this connector is ideal for space-constrained electronic products where compact design is critical. Its low-profile construction helps reduce overall device thickness while maintaining mechanical durability. <br><br> Designed for <strong>surface-mount assembly</strong> and right-angle mounting, the connector supports automated manufacturing processes and efficient PCB layouts. Gold-plated contact surfaces provide excellent electrical conductivity, low contact resistance, and long-term reliability under repeated insertion cycles. <br><br> The connector operates across a wide <strong>-40°C to +85°C temperature range</strong> and supports up to <strong>500 mating cycles</strong>, making it suitable for demanding industrial and commercial applications. Its stainless-steel shell construction enhances mechanical strength and protects the SIM card interface from damage. <br><br> Supporting a maximum contact current of <strong>0.5A</strong> and operating voltages up to <strong>10VDC</strong>, the 0787270001 delivers dependable electrical performance for cellular communication modules and embedded connectivity systems. <br><br> The <strong>0787270001</strong> is widely used in <strong>IoT devices, GSM and LTE modules, telematics systems, smart meters, industrial gateways, wireless communication equipment, asset tracking devices, automotive communication modules, handheld terminals, security systems, and embedded cellular applications</strong> requiring reliable micro-SIM card connectivity.
0787270001-SIM

Description: The 0787270001 is a compact micro-SIM card socket connector from ...
Package: T&R | MOQ: 1200 | MPQ: 1200

SI2304BDS-T1-GE3 / The SI2304BDS-T1-GE3 is a high-efficiency <strong>N-channel TrenchFET® power MOSFET</strong> from <strong>Vishay Siliconix</strong>, designed to deliver low conduction losses and reliable switching performance in compact power management applications. Its advanced trench MOSFET technology provides excellent efficiency while maintaining a small footprint for space-constrained electronic designs. <br><br> This device features a maximum <strong>drain-source voltage of 40V</strong> and supports continuous drain currents of up to <strong>2.8A</strong>, making it suitable for a broad range of low- and medium-power switching applications. The optimized silicon structure enables efficient operation in battery-powered and portable electronic systems. <br><br> The SI2304BDS-T1-GE3 offers a low <strong>RDS(ON)</strong> characteristic, reducing conduction losses and minimizing heat generation during operation. Its logic-level gate drive capability allows efficient switching performance when driven directly by microcontrollers, digital logic circuits, and low-voltage control systems. <br><br> Engineered for fast switching operation, the device features low gate charge and low input capacitance, helping improve efficiency in high-frequency switching circuits. These characteristics make it particularly suitable for DC-DC converters, load switching circuits, and power distribution applications. <br><br> The MOSFET is designed to operate across a wide temperature range and provides dependable performance under demanding electrical conditions. Its rugged construction and avalanche capability contribute to long-term reliability in industrial and consumer electronic equipment. <br><br> Packaged in a compact <strong>SOT-23 surface-mount package</strong>, the SI2304BDS-T1-GE3 enables high-density PCB layouts while simplifying automated assembly processes. The small package size makes it ideal for portable and space-sensitive applications. <br><br> Combining low power dissipation, fast switching speed, and logic-level gate operation, this MOSFET provides an efficient solution for modern power management designs requiring compact size and reliable performance. <br><br> The <strong>SI2304BDS-T1-GE3</strong> is widely used in <strong>DC-DC converters, battery-powered devices, load switch circuits, portable electronics, industrial controllers, power management modules, embedded systems, consumer electronics, communication equipment, LED drivers, and general-purpose power switching applications</strong>.
SI2304BDS-T1-GE3

Description: The SI2304BDS-T1-GE3 is a high-efficiency N-channel TrenchFET® power MOSFET ...
Package: T&R | MOQ: 3000 | MPQ: 3000

IRLML6344TRPBF / The IRLML6344TRPBF is a high-efficiency <strong>N-channel power MOSFET</strong> from <strong>Infineon Technologies</strong>, developed using advanced HEXFET® technology to provide excellent switching performance and low conduction losses in compact electronic designs. Its logic-level gate characteristics make it ideal for direct control from low-voltage digital circuits and microcontrollers. <br><br> This device features a maximum <strong>drain-source voltage of 30V</strong> and supports continuous drain currents up to <strong>5A</strong>, providing an efficient solution for power switching, load control, and power management applications. Its optimized silicon structure delivers outstanding performance while maintaining a compact footprint. <br><br> The IRLML6344TRPBF offers an ultra-low <strong>RDS(ON) of 29mΩ at VGS = 4.5V</strong> and <strong>37mΩ at VGS = 2.5V</strong>, helping minimize power dissipation and improve overall system efficiency. This low resistance characteristic makes it particularly suitable for battery-powered and energy-sensitive applications. <br><br> Designed as a <strong>logic-level MOSFET</strong>, the device can be fully enhanced with low gate drive voltages, enabling direct interfacing with modern 3.3V and 5V control systems. The low gate threshold voltage and optimized gate charge contribute to fast switching operation and reduced switching losses. <br><br> The MOSFET supports a maximum <strong>power dissipation of 1.3W</strong> and operates across a wide junction temperature range of <strong>-55°C to +150°C</strong>, ensuring reliable performance in industrial, consumer, and portable electronic applications. <br><br> Packaged in a compact <strong>SOT-23 (Micro3™) package</strong>, the IRLML6344TRPBF enables high-density PCB layouts while reducing board space requirements. Its small footprint and efficient thermal characteristics make it an excellent choice for space-constrained designs. <br><br> The device is optimized for <strong>load switching, system power control, DC-DC converters, battery management circuits, power distribution networks, portable electronics, and embedded power applications</strong>, where low on-resistance and efficient switching are critical requirements. <br><br> The <strong>IRLML6344TRPBF</strong> is widely used in <strong>battery-powered devices, mobile electronics, industrial controllers, IoT equipment, portable instruments, DC-DC power converters, load switch circuits, power management modules, communication devices, and embedded system power control applications</strong>.
IRLML6344TRPBF

Description: The IRLML6344TRPBF is a high-efficiency N-channel power MOSFET from ...
Package: T&R | MOQ: 3000 | MPQ: 3000

DMG2305UX-7 / The DMG2305UX-7 is a high-performance <strong>P-channel enhancement mode MOSFET</strong> from <strong>Diodes Incorporated</strong>, designed for efficient power switching and power management applications. Combining low on-resistance with fast switching characteristics, it provides an excellent solution for compact, high-efficiency electronic designs. <br><br> This device features a maximum <strong>drain-source voltage of -20V</strong> and supports continuous drain currents up to <strong>-4.2A</strong>, making it suitable for a wide range of low-voltage power control applications. Its optimized silicon design minimizes conduction losses while maintaining reliable switching performance. <br><br> The DMG2305UX-7 offers an exceptionally low <strong>RDS(ON) of 52mΩ at VGS = -4.5V</strong>, helping improve system efficiency and reduce heat generation during operation. Low input capacitance and optimized gate charge characteristics contribute to fast switching response and reduced switching losses. <br><br> Designed for modern low-voltage systems, the device supports gate drive voltages as low as <strong>1.8V</strong>, enabling direct interface with battery-powered electronics, microcontrollers, and portable applications. The low gate threshold voltage further enhances flexibility in power management circuits. <br><br> With a maximum power dissipation of <strong>1.4W</strong> and an operating junction temperature range of <strong>-55°C to +150°C</strong>, the MOSFET delivers dependable operation across a broad range of environmental conditions. Its robust construction ensures long-term reliability in demanding applications. <br><br> The compact <strong>SOT-23 package</strong> allows high-density PCB layouts while minimizing board space requirements. This makes the DMG2305UX-7 particularly attractive for portable electronics, compact industrial equipment, and space-constrained power designs. <br><br> Engineered to provide low leakage current, fast switching speed, and efficient power handling, the device is well suited for both switching and load management functions in modern electronic systems. <br><br> The <strong>DMG2305UX-7</strong> is widely used in <strong>DC-DC converters, battery-powered devices, load switching circuits, power management modules, backlighting systems, portable electronics, industrial control equipment, motor control circuits, consumer electronics, and high-efficiency power distribution applications</strong>.
DMG2305UX-7

Description: The DMG2305UX-7 is a high-performance P-channel enhancement mode MOSFET f ...
Package: T&R | MOQ: 3000 | MPQ: 3000

MPXM2051GST1 / The MPXM2051GST1 is a highly accurate <strong>silicon piezoresistive pressure sensor</strong> from <strong>NXP Semiconductors</strong>, designed to provide precise and stable pressure measurements for industrial, medical, and embedded sensing applications. The device integrates advanced sensing technology with on-chip signal conditioning to deliver a linear voltage output directly proportional to the applied pressure. <br><br> This sensor measures pressure within a range of <strong>0 kPa to 50 kPa</strong> and incorporates <strong>on-chip temperature compensation and calibration</strong>, ensuring reliable performance across varying environmental conditions. The factory-trimmed sensing element minimizes offset and sensitivity errors while improving long-term measurement stability. <br><br> The MPXM2051GST1 utilizes a <strong>monolithic silicon diaphragm</strong> with integrated strain gauges and thin-film resistor networks. This construction enables highly accurate pressure detection while maintaining excellent repeatability and linearity throughout the operating range. <br><br> Designed as a <strong>gauge pressure sensor</strong>, the device provides a ratiometric analog output that scales proportionally with supply voltage. This characteristic simplifies interfacing with analog-to-digital converters, microcontrollers, and data acquisition systems used in modern control and monitoring equipment. <br><br> The integrated temperature compensation circuitry provides optimized performance over the <strong>0°C to +85°C</strong> compensated temperature range. This feature helps maintain measurement accuracy without requiring extensive external calibration or compensation algorithms. <br><br> Its compact <strong>MPAK surface-mount package</strong> enables efficient PCB integration in space-constrained designs while supporting automated assembly processes. The sensor is designed for use with clean, dry air and delivers dependable performance in applications requiring precise low-pressure measurement. <br><br> The MPXM2051GST1 offers excellent linearity, low pressure hysteresis, and stable output characteristics, making it suitable for demanding sensing applications where measurement accuracy and reliability are critical. <br><br> The <strong>MPXM2051GST1</strong> is widely used in <strong>medical diagnostic equipment, respiratory monitoring systems, industrial automation, robotics, pressure control systems, pump and motor controllers, environmental monitoring equipment, laboratory instrumentation, HVAC systems, fluid level measurement devices, and precision pressure sensing applications</strong>.
MPXM2051GST1

Description: The MPXM2051GST1 is a highly accurate silicon piezoresistive pressure sensor ...
Package: T&R | MOQ: 400 | MPQ: 400

166.7000.5102 / The 166.7000.5102 is a robust <strong>automotive blade fuse</strong> from <strong>Littelfuse</strong>, engineered to provide reliable overcurrent protection in demanding automotive and industrial DC power systems. As part of the trusted <strong>FKS ATO® series</strong>, it combines proven blade fuse technology with enhanced voltage capability for modern electrical architectures. <br><br> Rated at <strong>10A and 80VDC</strong>, this fuse is designed to protect wiring, electronic modules, and power distribution circuits from overloads and short-circuit conditions. Its fast and dependable operation helps prevent damage to sensitive electrical components while maintaining system safety. <br><br> The fuse utilizes a durable <strong>three-part construction with copper contacts</strong>, providing excellent conductivity, low voltage drop, and long-term reliability. This design improves electrical performance while minimizing heat generation under normal operating conditions. <br><br> Featuring a <strong>1kA interrupting rating</strong>, the 166.7000.5102 can safely interrupt high fault currents, making it suitable for demanding vehicle electrical systems, battery-powered equipment, and DC distribution networks. The integrated arc-quenching construction further enhances protection during fault events. <br><br> Its standard <strong>ATO/ATC blade format</strong> allows easy installation and replacement in compatible fuse holders. The compact form factor simplifies integration into automotive fuse panels, control units, battery management systems, and auxiliary power circuits. <br><br> The fuse offers low internal resistance of approximately <strong>7.9mΩ</strong>, helping maintain efficient power delivery while reducing energy losses. Its red housing enables quick identification of the <strong>10A current rating</strong> during maintenance and servicing operations. <br><br> Manufactured to meet stringent automotive reliability standards, the 166.7000.5102 delivers dependable circuit protection in environments exposed to vibration, temperature fluctuations, and electrical transients. <br><br> The <strong>166.7000.5102</strong> is widely used in <strong>automotive electrical systems, commercial vehicles, battery-powered equipment, power distribution modules, electric utility vehicles, industrial control systems, DC power networks, auxiliary vehicle circuits, battery protection assemblies, and transportation electronics</strong>, where reliable overcurrent protection is essential.
166.7000.5102

Description: The 166.7000.5102 is a robust automotive blade fuse from Littelfu ...
Package: BULK | MOQ: 500 | MPQ: 500

PCA9535APW / The PCA9535APW,118 is a versatile <strong>16-bit I²C-bus GPIO expander</strong> from <strong>NXP Semiconductors</strong>, designed to provide additional digital input and output capability for microcontrollers and embedded systems. By using a standard I²C or SMBus interface, the device significantly increases available I/O resources while minimizing PCB routing complexity and processor pin requirements. <br><br> This device provides <strong>16 individually programmable GPIO pins</strong> organized into two 8-bit ports. Each pin can be independently configured as either an input or output, offering exceptional flexibility for a wide variety of digital control and monitoring applications. <br><br> Operating across a wide <strong>2.3V to 5.5V supply voltage range</strong>, the PCA9535APW,118 is compatible with both low-voltage and standard logic systems. The device supports <strong>5V-tolerant I/O pins</strong>, enabling seamless integration into mixed-voltage environments. <br><br> The integrated <strong>interrupt output</strong> allows the host processor to detect input state changes without continuously polling the device. This feature helps reduce processor workload and lowers overall system power consumption, making it ideal for battery-powered and energy-efficient designs. <br><br> The PCA9535APW,118 incorporates dedicated <strong>input, output, polarity inversion, and configuration registers</strong>, providing complete control over each GPIO channel. The polarity inversion function allows software-configurable active-high or active-low operation without requiring additional external circuitry. <br><br> Three hardware address pins enable up to <strong>eight devices on a single I²C bus</strong>, allowing designers to expand systems to a total of 128 GPIO lines while maintaining a simple two-wire communication interface. The device supports I²C and SMBus communication speeds up to <strong>400kHz</strong>. <br><br> Designed for low-power operation, the PCA9535APW,118 combines minimal standby current with reliable digital performance, making it suitable for portable, industrial, and consumer applications. Its compact <strong>24-pin TSSOP package</strong> provides a space-efficient solution for high-density PCB layouts. <br><br> The <strong>PCA9535APW,118</strong> is widely used in <strong>industrial automation systems, embedded controllers, IoT devices, communication equipment, consumer electronics, LED control systems, sensor interfaces, building automation products, networking hardware, medical equipment, and microcontroller-based applications</strong> requiring additional programmable digital I/O channels.
PCA9535APW

Description: The PCA9535APW,118 is a versatile 16-bit I²C-bus GPIO expander from ...
Package: T&R | MOQ: 2500 | MPQ: 2500

BQ79616PAPRQ1 / The BQ79616PAPRQ1 is a highly integrated <strong>automotive battery monitor, balancer, and protection IC</strong> from <strong>Texas Instruments</strong>, specifically developed for advanced battery management systems used in electric vehicles, hybrid vehicles, and energy storage applications. Designed to support functional safety requirements, it provides precise battery monitoring and protection for high-voltage battery packs. <br><br> This device supports monitoring of up to <strong>16 series-connected battery cells</strong> and delivers highly accurate voltage measurements with <strong>±1.5mV ADC accuracy</strong>. Fast measurement capability allows all cell voltages to be captured within <strong>128µs</strong>, enabling rapid system diagnostics and improved battery management performance. <br><br> The BQ79616PAPRQ1 integrates advanced <strong>cell balancing functionality</strong> with balancing currents up to <strong>240mA</strong>. Built-in thermal management automatically pauses and resumes balancing operations when necessary, helping maintain safe operating conditions and extending battery life. <br><br> Designed for safety-critical automotive applications, the device supports <strong>ISO 26262 functional safety architectures up to ASIL-D</strong>. Integrated diagnostic features, redundant measurement paths, fault monitoring functions, and hardware protection mechanisms help improve system reliability and support compliance with stringent automotive safety standards. <br><br> The IC includes <strong>overvoltage, undervoltage, open-wire, temperature, and fault detection capabilities</strong>, providing comprehensive monitoring of battery pack health. Integrated digital filtering improves measurement stability and contributes to more accurate state-of-charge and state-of-health calculations. <br><br> For scalable battery pack architectures, the BQ79616PAPRQ1 features <strong>isolated differential daisy-chain communication</strong> with optional ring topology support. This architecture allows reliable communication across multiple battery monitoring devices while reducing wiring complexity in large battery systems. <br><br> Additional flexibility is provided through integrated GPIO and auxiliary measurement channels, enabling connection of external thermistors and system monitoring components. Support for UART and SPI-based communication interfaces simplifies integration with host controllers and battery management processors. <br><br> Packaged in a compact <strong>64-pin HTQFP package</strong>, the BQ79616PAPRQ1 is widely used in <strong>electric vehicles, hybrid electric vehicles, battery energy storage systems, industrial battery packs, high-voltage power systems, automotive battery management systems, renewable energy storage platforms, and advanced lithium-ion battery monitoring applications</strong>, where precise cell measurement, balancing, and functional safety compliance are critical.
BQ79616PAPRQ1

Description: The BQ79616PAPRQ1 is a highly integrated automotive battery monitor, balancer, and ...
Package: T&R | MOQ: 1000 | MPQ: 1000

SN75176BP / The SN75176BP is a reliable <strong>differential bus transceiver</strong> from <strong>Texas Instruments</strong>, specifically designed for bidirectional data communication over <strong>RS-485 and RS-422 networks</strong>. It integrates both a differential line driver and a differential receiver into a single compact device, providing an efficient solution for industrial and long-distance communication systems. <br><br> This device supports <strong>half-duplex communication</strong> and is optimized for multipoint bus architectures where multiple nodes share the same communication line. Its balanced differential signaling helps improve noise immunity and enables stable data transmission in electrically demanding environments. <br><br> Operating from a single <strong>5V power supply</strong>, the SN75176BP simplifies system design while delivering reliable communication performance. The integrated driver and receiver feature independent enable controls, allowing flexible management of transmit and receive functions within networked applications. <br><br> The transceiver complies with <strong>TIA/EIA-485-A and TIA/EIA-422-B standards</strong>, making it suitable for a wide range of industrial communication protocols and fieldbus implementations. Its differential architecture allows robust data transmission across long cable distances while maintaining excellent resistance to electromagnetic interference. <br><br> The SN75176BP provides <strong>high-current differential outputs up to ±60mA</strong>, thermal shutdown protection, current limiting functions, and a receiver input sensitivity of <strong>±200mV</strong>. These features contribute to enhanced system reliability and protection against line faults and abnormal operating conditions. <br><br> Designed with <strong>3-state driver and receiver outputs</strong>, the device minimizes bus loading when disabled and supports multipoint network configurations with up to 32 connected nodes. Its wide common-mode voltage tolerance further improves communication stability in industrial installations. <br><br> Housed in a compact <strong>8-pin PDIP package</strong>, the SN75176BP is widely used in <strong>industrial automation systems, PLCs, motor control equipment, building automation, factory networking, process control systems, security systems, data acquisition equipment, instrumentation, and RS-485 communication interfaces</strong>, where dependable differential data transmission is required.
SN75176BP

Description: The SN75176BP is a reliable differential bus transceiver from Tex ...
Package: | MOQ: | MPQ:

ADL5513ACPZ-R7 / The ADL5513ACPZ-R7 is a high-performance <strong>TruPwr™ RMS RF power detector</strong> from <strong>Analog Devices</strong>, designed to accurately measure the true RMS power of complex RF and communication signals across a wide frequency range. It is optimized for wireless infrastructure, test equipment, instrumentation, transmit power control, and RF monitoring applications. <br><br>This device operates over an exceptionally broad frequency range of <strong>1MHz to 4GHz</strong>, allowing accurate power measurement across multiple wireless communication standards and RF system architectures. Its true RMS measurement capability enables precise monitoring of both continuous-wave and complex modulated signals. <br><br>The ADL5513ACPZ-R7 incorporates Analog Devices' advanced <strong>TruPwr™ detection technology</strong>, providing accurate power measurement independent of waveform characteristics. This capability makes it particularly suitable for modern communication systems utilizing OFDM, CDMA, W-CDMA, LTE, and other high crest-factor modulation schemes. <br><br>The device offers a wide dynamic measurement range of approximately <strong>60dB</strong>, enabling accurate detection of RF signal levels across varying operating conditions. Its output voltage is proportional to the measured RMS input power, simplifying integration into automatic gain control (AGC), transmitter monitoring, and power management systems. <br><br>Operating from a <strong>2.7V to 5.5V supply voltage</strong>, the ADL5513ACPZ-R7 combines high measurement accuracy with low power consumption. The device also features fast response times and excellent temperature stability, helping maintain reliable performance in demanding RF environments. <br><br>Packaged in a compact <strong>16-lead LFCSP package measuring approximately 3mm × 3mm</strong>, the ADL5513ACPZ-R7 enables high-density RF PCB designs while maintaining excellent electrical performance. <br><br>The <strong>ADL5513ACPZ-R7</strong> is widely used in <strong>wireless base stations, RF power monitoring systems, communication test equipment, signal analyzers, transmitter power control circuits, cellular infrastructure, broadband radio systems, RF instrumentation, and automatic gain control applications</strong>, where accurate RMS power measurement and wideband RF performance are essential.
ADL5513ACPZ-R7

Description: The ADL5513ACPZ-R7 is a high-performance TruPwr™ RMS RF power detector ...
Package: T&R | MOQ: 1500 | MPQ: 1500

LTC2942IDCB#TRPBF / The LTC2942IDCB#TRPBF is a highly integrated <strong>battery gas gauge and monitoring IC</strong> from <strong>Analog Devices</strong>, designed to accurately measure battery charge, voltage, and temperature in portable and battery-powered electronic systems. It is optimized for <strong>single-cell Li-Ion battery applications</strong>, providing precise battery status information to improve power management and runtime estimation. <br><br>This device utilizes a high-accuracy <strong>coulomb counting architecture</strong> that continuously integrates charge and discharge current through an external sense resistor. By monitoring the accumulated battery charge, the LTC2942IDCB#TRPBF enables accurate state-of-charge tracking and battery utilization management. <br><br>In addition to charge measurement, the device incorporates an internal <strong>14-bit ADC</strong> capable of measuring battery voltage and on-chip temperature. These measurements are stored in internal registers and can be accessed through a standard <strong>SMBus/I²C-compatible interface</strong>, allowing seamless integration with microcontrollers and embedded processors. <br><br>The LTC2942IDCB#TRPBF operates from a <strong>2.7V to 5.5V supply voltage range</strong> and features a <strong>±50mV sense voltage range</strong>, making it suitable for a wide variety of low-power battery-operated devices. Its quiescent current consumption is typically below <strong>100µA</strong>, helping maximize battery life in portable applications. <br><br>The device includes programmable <strong>high and low threshold alarms</strong> for charge, voltage, and temperature measurements. Alert conditions can be communicated through an alert output pin or status registers, enabling intelligent battery management and system protection. <br><br>Packaged in a compact <strong>6-pin DFN (2mm × 3mm) surface-mount package</strong>, the LTC2942IDCB#TRPBF is ideal for space-constrained designs requiring accurate battery monitoring capabilities. <br><br>The <strong>LTC2942IDCB#TRPBF</strong> is widely used in <strong>portable medical devices, handheld instruments, wireless sensors, GPS equipment, portable consumer electronics, battery-powered industrial systems, IoT devices, and smart energy management applications</strong>, where accurate battery charge tracking and low power consumption are critical.
LTC2942IDCB#TRPBF

Description: The LTC2942IDCB#TRPBF is a highly integrated battery gas gauge and monitoring IC ...
Package: T&R | MOQ: 2500 | MPQ: 2500













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