W664GG6RB-06
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| Part Number | W664GG6RB-06 |
|---|---|
| Manufacturer |
 Winbond
|
| Description | The W664GG6RB-06 is a high-performance 4Gbit DDR4 SDRAM memory IC developed by Winbond Electronics, designed for high-speed data processing and embedded system applications. It features a memory organization of 256M × 16 bits, providing efficient data storage and transfer for modern digital systems. The device supports DDR4 technology with data rates up to 3200 Mbps (1600 MHz clock), enabling high bandwidth and fast data access suitable for demanding applications such as industrial controllers, networking devices, and advanced embedded platforms. Operating with a low supply voltage of approximately 1.2V (1.14V – 1.26V), the W664GG6RB-06 offers improved energy efficiency compared to previous DDR generations while maintaining high performance. It incorporates an 8-bank architecture with 8n prefetch, ensuring optimized memory throughput and efficient parallel access. The device features a POD_12 interface, differential clocking, and advanced DDR4 functions such as on-die termination (ODT), data bus inversion, ZQ calibration, and programmable latency control, ensuring signal integrity and reliable operation in high-speed environments. With a typical access time of ~18 ns and fast write cycles (~15 ns), the memory is suitable for latency-sensitive applications. It operates over a temperature range of 0°C to +95°C, making it suitable for commercial and industrial-grade systems. Packaged in a compact 96-ball VFBGA form factor, the W664GG6RB-06 is optimized for high-density PCB designs and space-constrained applications. It is widely used in embedded systems, industrial automation, networking equipment, consumer electronics, and high-performance computing modules where fast and reliable volatile memory is required. Equivalent: NT5AD256M16E4-JR, NT5AD256M16E4-JR TR, MT40A256M16LY-062E, MT40A256M16GE-062E, MT40A256M16TB-062E, K4A4G165WE-BCRC, K4A4G165WF-BCTD, K4A4G165WB-BCRC, H5AN4G6NBJR-UHC, H5AN4G6NAFR-UHC, H5AN4G6NBMR-UHC |
| Product Group | SDRAM |
| MOQ | 198 pcs |
| SPQ | 198 pcs |
| Figure/Case | 96-VFBGA |
| Package | TRAY Pack |
 PDF Datasheet | |
| Ship From | Hong Kong |
| Shipment Way | DHL / Fedex / TNT / UPS / Others |
| Delivery Term | Ex-Works |
| Send RFQ | sales@signalhk.com |
| Parameter | Value |
|---|---|
| Manufacturer | Winbond Electronics |
| Manufacturer Part Number | W664GG6RB-06. |
| Device Type | DDR4 SDRAM memory IC. |
| Density | 4 Gbit. |
| Organization | 256M × 16. |
| Interface | POD12. |
| Prefetch Architecture | 8-bit prefetch. |
| Bank Groups | 2 |
| Banks per Bank Group | 4 banks total addressing via BG0 and BA0-BA1. |
| Row Address | A0-A14. |
| Column Address | A0-A9. |
| Page Size | 2 KB. |
| Speed Grade | DDR4-3200, 22-22-22. |
| Max Clock Frequency | 1600 MHz. |
| Max Data Rate | 3200 Mbps. |
| Access Time | 18 ns. |
| Write Cycle Time (word/page) | 15 ns. |
| tAA | 13.75 ns min, 18.00 ns max. |
| tRCD | 13.75 ns min. |
| tRP | 13.75 ns min. |
| tRAS | 32 ns min. |
| tRC | 45.75 ns min. |
| Recommended VDD | 1.14 V min, 1.20 V typ, 1.26 V max. |
| Recommended VDDQ | 1.14 V min, 1.20 V typ, 1.26 V max. |
| Recommended VPP | 2.375 V min, 2.50 V typ, 2.75 V max. |
| Supply Voltage Summary | VDD/VDDQ = 1.2 V ±60 mV; VPP = 2.5 V -125 mV / +250 mV. |
| VREFCA(DC) | 0.49 × VDD min to 0.51 × VDD max. |
| Absolute Max VDD | -0.3 V to 1.5 V. |
| Absolute Max VDDQ | -0.3 V to 1.5 V. |
| Absolute Max VPP | -0.3 V to 3.0 V. |
| Absolute Max VIN/VOUT | -0.3 V to 1.5 V, except VREFCA. |
| Operating Temperature Range | 0°C to 95°C (TCASE / TC) for W664GG6RB-06. |
| Temperature Definition | Operating temperature is specified as case temperature at the center/top side of the DRAM. |
| Storage Temperature Range | -55°C to 150°C. |
| Refresh Interval, 0°C to 85°C | tREFI = 7.8 µs. |
| Refresh Interval, 85°C to 95°C | tREFI = 3.9 µs. |
| Relative Humidity | No explicit operating/storage RH value was located in the primary datasheet reviewed. |
| Moisture Sensitivity Level | MSL 3, 168 hours. |
| Moisture Sensitive | Yes. |
| Mounting Type | Surface mount. |
| Package | 96-ball VFBGA. |
| Package Body Size | 7.5 mm × 13.0 mm nominal. |
| Package Thickness (A) | 0.80 mm min, 0.90 mm nom, 1.00 mm max. |
| Stand-off Height (A1) | 0.25 mm min, 0.40 mm max. |
| Solder Ball Diameter (b) | 0.40 mm min, 0.50 mm max. |
| Package Length (D) | 12.90 mm min, 13.00 mm nom, 13.10 mm max. |
| Package Width (E) | 7.40 mm min, 7.50 mm nom, 7.60 mm max. |
| Ball Array Span D1 | 12.00 mm BSC. |
| Ball Array Span E1 | 6.40 mm BSC. |
| Ball Pitch eD | 0.80 mm BSC. |
| Ball Pitch eE | 0.80 mm BSC. |
| Ball Land | 0.5 mm. |
| Ball Opening | 0.4 mm. |
| Suggested PCB Ball Land | ≤ 0.4 mm. |
| RoHS / Lead-Free | Lead-free materials, RoHS compliant. |
| Packaging | Tray. |
| Part Status | Active. |
W664GG6RB-06
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