AS4C64M16D2A-25BIN
The image is for illustrative purposes only; please refer to the product data sheet for precise specifications.
GET QUOTE NOW!
| Part Number | AS4C64M16D2A-25BIN |
|---|---|
| Manufacturer |
 Alliance Semiconductor
|
| Description | The AS4C64M16D2A-25BIN is a high-speed, 1-gigabit (Gb) DDR2 Synchronous Dynamic Random-Access Memory (SDRAM) from Alliance Memory, organized as 64 million words by 16 bits (64M x 16). Designed for high-performance applications, it features a double-data-rate architecture with an 8n prefetch, enabling data transfer rates up to 400 MHz. The device operates with a supply voltage range of 1.7V to 1.9V and supports fully synchronous operations with a differential clock (CK and CK#). It includes eight internal banks for concurrent operation and offers programmable CAS latencies of 3, 4, and 5. Additional features encompass bidirectional single/differential data strobes (DQS and DQS#), on-die termination (ODT), off-chip driver (OCD) impedance adjustment, and automatic self-refresh with a refresh period of 7.8 µs. The AS4C64M16D2A-25BIN is housed in an 84-ball FBGA package and operates within an industrial temperature range of -40°C to 95°C, making it suitable for various applications requiring reliable and efficient memory solutions. T&R Part Number: AS4C64M16D2A-25BINTR |
| Product Group | SDRAM |
| MOQ | 418 pcs |
| SPQ | 209 pcs |
| Figure/Case | 84-FBGA |
| Package | TRAY Pack |
 PDF Datasheet | |
| Ship From | Hong Kong |
| Shipment Way | DHL / Fedex / TNT / UPS / Others |
| Delivery Term | Ex-Works |
| Send RFQ | sales@signalhk.com |
| Parameter | Value | Notes |
|---|---|---|
| Memory Configuration | 64 Meg x 16 | Organized as 64 million words by 16 bits |
| Memory Size | 1 Gbit | Total memory capacity |
| Clock Frequency (Max) | 400 MHz | Maximum operating clock frequency |
| Access Time | 400 ps | Time delay between address input and data output |
| Supply Voltage (VDD) | 1.7 V to 1.9 V | Nominal operating voltage range |
| Supply Current (Max) | 170 mA | Maximum current consumption during operation |
| Operating Temperature Range | -40°C to +95°C | Suitable for industrial applications |
| Package Type | 84-ball FBGA | Surface-mount package with 84 pins |
| Data Bus Width | 16 bits | Width of the data bus |
| Write Cycle Time (Word/Page) | 15 ns | Time required to complete a write cycle |
| Input Logic Level High (VIH) | 0.7 x VDD to VDD + 0.3 V | Voltage range recognized as a logical high |
| Input Logic Level Low (VIL) | -0.3 V to 0.3 x VDD | Voltage range recognized as a logical low |
| Output Logic Level High (VOH) | VDD - 0.1 V (min) | Minimum voltage level for logical high output |
| Output Logic Level Low (VOL) | 0.1 V (max) | Maximum voltage level for logical low output |
| Refresh Period | 7.8 µs | Time interval for refresh cycles |
| On-Die Termination (ODT) | Supported | Allows impedance matching on the chip |
| Off-Chip Driver (OCD) Impedance Adjustment | Supported | Enables adjustment of output driver impedance |
Request quotation for
AS4C64M16D2A-25BIN
AS4C64M16D2A-25BIN